Kingston Technology HX316LS9IB/8

ECCN (US)

EAR99

HTS

8473.30.11.40

Module

DRAM模块

Module Density

8Gbyte

Number of Chip per Module

16

Chip Density (bit)

4G

Data Bus Width (bit)

64

Maximum Clock Rate (MHz)

1600

Chip Configuration

512Mx8

Chip Package Type

FBGA

Minimum Operating Supply Voltage (V)

1.28/1.425

Typical Operating Supply Voltage (V)

1.35/1.5

Maximum Operating Supply Voltage (V)

1.45/1.575

Minimum Operating Temperature (°C)

0

Maximum Operating Temperature (°C)

85

Module Sides

Double

ECC Support

无

Number of Ranks

Dual

Number of Chip Banks

8

CAS Latency

9

SPD EEPROM Support

无

Standard Package Name

DIMM

Supplier Package

SODIMM

Mounting

Socket

Package Height

30

Package Length

67.6

PCB changed

204

Lead Shape

No Lead

零件状态

活跃

引脚数量

204

组织结构

1Gx64

锁相环

无

自我刷新

无

模块类型

204SODIMM

RoHS状态

是,有豁免