Kingston Technology HX318C10FRK2/8

Lead Shape

No Lead

PCB changed

240

Package Length

133.35

Package Height

30

Mounting

Socket

Supplier Package

DIMM

Standard Package Name

DIM

SPD EEPROM Support

无

CAS Latency

10

Number of Chip Banks

8

Number of Ranks

Single

ECC Support

无

Module Sides

Single

Maximum Operating Temperature (°C)

85

Minimum Operating Temperature (°C)

0

Maximum Operating Supply Voltage (V)

1.575

Typical Operating Supply Voltage (V)

1.5

Minimum Operating Supply Voltage (V)

1.425

Chip Package Type

FBGA

Chip Configuration

512Mx8

Maximum Clock Rate (MHz)

1866

Data Bus Width (bit)

64

Chip Density (bit)

4G

Number of Chip per Module

16

Module Density

8Gbyte

Module

DRAM模块

HTS

8473.30.11.40

ECCN (US)

EAR99

零件状态

活跃

引脚数量

240

组织结构

512Mx64x2

锁相环

无

自我刷新

无

模块类型

240DIMM

RoHS状态

是,有豁免