Kingston Technology KVR13N9S6/2

HTS

8542.32.00.36

Module

DRAM模块

Module Density

2Gbyte

Number of Chip per Module

4

Chip Density (bit)

4G

Data Bus Width (bit)

64

Maximum Clock Rate (MHz)

1333

Chip Configuration

256Mx16

Chip Package Type

FBGA

Minimum Operating Supply Voltage (V)

1.425

Typical Operating Supply Voltage (V)

1.5

Maximum Operating Supply Voltage (V)

1.575

Minimum Operating Temperature (°C)

0

Maximum Operating Temperature (°C)

85

Module Sides

Single

ECC Support

无

Number of Ranks

Single

CAS Latency

9

PC Type

PC3-10600

SPD EEPROM Support

有

Standard Package Name

DIM

Supplier Package

DIMM

Mounting

Socket

Package Height

30

Package Length

133.35

PCB changed

240

Lead Shape

No Lead

ECCN (US)

EAR99

零件状态

LTB

引脚数量

240

组织结构

256Mx64

锁相环

无

自我刷新

有

模块类型

240DIMM

RoHS状态

是,有豁免