Kingston Technology KVR667D2N5K2/2G

表面安装

NO

终端数量

240

ECCN (US)

EAR99

Module

DRAM模块

Module Density

2Gbyte

Number of Chip per Module

16

Chip Density (bit)

1G

Data Bus Width (bit)

64

Maximum Clock Rate (MHz)

667

Chip Configuration

128Mx8

Chip Package Type

FBGA

Minimum Operating Supply Voltage (V)

1.7

Typical Operating Supply Voltage (V)

1.8

Maximum Operating Supply Voltage (V)

1.9

Module Sides

Single

ECC Support

无

CAS Latency

5

SPD EEPROM Support

无

Standard Package Name

DIM

Supplier Package

DIMM

Mounting

Socket

Package Height

18.3

Package Length

133.35

PCB changed

240

Lead Shape

No Lead

Package Description

DIMM,

Package Style

微电子组件

Number of Words Code

128000000

Package Body Material

UNSPECIFIED

Reflow Temperature-Max (s)

未说明

Rohs Code

有

Manufacturer Part Number

KVR667D2N5K2/2G

Number of Words

134217728 words

Supply Voltage-Nom (Vsup)

1.8 V

Package Code

DIMM

Package Shape

RECTANGULAR

Manufacturer

Kingston Technology Company

Part Life Cycle Code

Obsolete

Ihs Manufacturer

KINGSTON TECHNOLOGY COMPANY INC

Risk Rank

5.74

零件状态

Obsolete

附加功能

SEATED HGT-NOM

技术

CMOS

端子位置

DUAL

终端形式

无铅

峰值回流焊温度（摄氏度）

未说明

功能数量

2

Reach合规守则

compliant

引脚数量

240

JESD-30代码

R-XDMA-N240

电源电压-最大值(Vsup)

1.9 V

电源电压-最小值(Vsup)

1.7 V

端口的数量

1

操作模式

SYNCHRONOUS

组织结构

128Mx64x2

座位高度-最大

18.3 mm

内存宽度

64

记忆密度

8589934592 bit

锁相环

无

内存IC类型

DDR内存模块

自我刷新

无

模块类型

240DIMM

长度

133.35 mm

RoHS状态

供应商未确认