Kingston Technology KVR16S11/2

ECCN (US)

EAR99

HTS

8542.32.00.36

Module

DRAM模块

Module Density

2Gbyte

Number of Chip per Module

8

Chip Density (bit)

2G

Data Bus Width (bit)

64

Maximum Clock Rate (MHz)

1600

Chip Configuration

256Mx8

Chip Package Type

FBGA

Minimum Operating Supply Voltage (V)

1.425

Typical Operating Supply Voltage (V)

1.5

Maximum Operating Supply Voltage (V)

1.575

Minimum Operating Temperature (°C)

0

Maximum Operating Temperature (°C)

85

Module Sides

Double

ECC Support

无

Number of Ranks

Single

Number of Chip Banks

8

CAS Latency

11

PC Type

PC3-12800

SPD EEPROM Support

无

Standard Package Name

DIMM

Supplier Package

SODIMM

Mounting

Socket

Package Height

30

Package Length

67.6

PCB changed

204

Lead Shape

No Lead

零件状态

Obsolete

引脚数量

204

组织结构

256Mx64

锁相环

无

自我刷新

无

模块类型

204SODIMM

RoHS状态

是,有豁免