NXP Semiconductors PESD3V3Z1BSF

Contact plating

gold-plated

表面安装

YES

Number of pins

15

二极管元件材料

SILICON

终端数量

2

外壳材料

1

Gross weight

1.29 g

Connector pinout layout

1x15

Electrical mounting

THT

Contacts pitch

2.54mm

Spatial orientation

straight

Kind of connector

female

Connector

socket

Type of connector

pin strips

Package Style

CHIP CARRIER

Package Shape

RECTANGULAR

Package Body Material

PLASTIC/EPOXY

Operating Temperature-Min

-40 °C

Operating Temperature-Max

125 °C

Date Of Intro

2016-10-31

Package Description

DSN0603-2, 2 PIN

Ihs Manufacturer

NXP SEMICONDUCTORS

Part Life Cycle Code

Transferred

Operating temperature

-40...163°C

ECCN 代码

EAR99

HTS代码

8541.10.00.50

端子位置

BOTTOM

终端形式

无铅

Reach合规守则

unknown

Current rating

1.5A

参考标准

IEC-60134; IEC-61000-4-2, 4-5

JESD-30代码

R-PBCC-N2

极性

BIDIRECTIONAL

配置

SINGLE

二极管类型

跨压抑制二极管

Rep Pk反向电压-最大值

3.3 V

Rated voltage

60V

个人资料

beryllium copper

Plating thickness

0.75µm

Flammability rating

UL94V-0