NXP USA Inc. IP4855CX25/C

表面安装

YES

终端数量

25

Manufacturer Part Number

IP4855CX25/C

Part Life Cycle Code

Transferred

Ihs Manufacturer

NXP SEMICONDUCTORS

Package Description

VFBGA,

Risk Rank

5.61

Operating Temperature-Max

85 °C

Operating Temperature-Min

-40 °C

Package Body Material

PLASTIC/EPOXY

Package Code

VFBGA

Package Shape

SQUARE

Package Style

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Supply Voltage-Max

5.5 V

Supply Voltage-Nom

2.9 V

Supply Voltage-Min

2.5 V

端子位置

BOTTOM

终端形式

BALL

功能数量

1

端子间距

0.4 mm

Reach合规守则

unknown

JESD-30代码

S-PBGA-B25

温度等级

INDUSTRIAL

座位高度-最大

0.55 mm

接口IC类型

电路接口

长度

2.05 mm

宽度

2.05 mm