Samsung Semiconductor K4B1G1646E-HCF7000

引脚数

96

ECCN (US)

EAR99

Automotive

无

PPAP

无

DRAM Type

DDR3 SDRAM

Chip Density (bit)

1G

Number of Internal Banks

8

Number of Words per Bank

8M

Number of Bits/Word (bit)

16

Data Bus Width (bit)

16

Maximum Clock Rate (MHz)

800

Maximum Access Time (ns)

20

Address Bus Width (bit)

16

Interface Type

SSTL_1.5

Minimum Operating Supply Voltage (V)

1.425

Typical Operating Supply Voltage (V)

1.5

Maximum Operating Supply Voltage (V)

1.575

Minimum Operating Temperature (°C)

0

Maximum Operating Temperature (°C)

95

Supplier Temperature Grade

Commercial

Number of I/O Lines (bit)

16

Mounting

表面贴装

Package Width

7.5

Package Length

13.3

PCB changed

96

Standard Package Name

BGA

Supplier Package

FBGA

Lead Shape

Ball

包装

Tray

零件状态

Obsolete

组织结构

64Mx16