Samsung Semiconductor K4B2G0846F-BYMA0CV

引脚数

78

Lead Shape

Ball

Supplier Package

FBGA

Standard Package Name

BGA

PCB changed

78

Package Length

11

Package Width

7.5

Mounting

表面贴装

Number of I/O Lines (bit)

8

Supplier Temperature Grade

Commercial

Maximum Operating Temperature (°C)

95

Minimum Operating Temperature (°C)

0

Operating Current (mA)

90

Maximum Operating Supply Voltage (V)

1.575|1.45

Typical Operating Supply Voltage (V)

1.5|1.35

Minimum Operating Supply Voltage (V)

1.425|1.283

Address Bus Width (bit)

18

Maximum Access Time (ns)

0.195

Maximum Clock Rate (MHz)

1866

Data Bus Width (bit)

8

Number of Bits/Word (bit)

8

Number of Words per Bank

32M

Number of Internal Banks

8

Chip Density (bit)

2G

DRAM Type

DDR3L SDRAM

PPAP

无

Automotive

无

ECCN (US)

EAR99

EU RoHS

Compliant

零件状态

活跃

组织结构

256Mx8