Samsung Semiconductor K4B2G1646F-BMK0000

EU RoHS

Compliant

ECCN (US)

EAR99

HTS

8542.32.00.36

Automotive

无

PPAP

无

DRAM Type

DDR3L SDRAM

Chip Density (bit)

2G

Number of Internal Banks

8

Number of Words per Bank

16M

Number of Bits/Word (bit)

16

Data Bus Width (bit)

16

Maximum Clock Rate (MHz)

1600

Maximum Access Time (ns)

0.225

Address Bus Width (bit)

17

Minimum Operating Supply Voltage (V)

1.283|1.425

Typical Operating Supply Voltage (V)

1.35|1.5

Maximum Operating Supply Voltage (V)

1.45|1.575

Operating Current (mA)

118

Minimum Operating Temperature (°C)

-40

Maximum Operating Temperature (°C)

95

Supplier Temperature Grade

Industrial

Number of I/O Lines (bit)

16

Mounting

表面贴装

Package Height

0.73

Package Width

7.5

Package Length

13.3

PCB changed

96

Standard Package Name

BGA

Supplier Package

FBGA

Lead Shape

Ball

零件状态

活跃

引脚数量

96

组织结构

128Mx16