Samsung Semiconductor K4B2G1646F-BMMATCV
- 收藏
- 对比
K4B2G1646F-BMMATCV
2107-K4B2G1646F-BMMATCV
存储器
--
大陆
立即发货

K4B2G1646F-BMMATCV datasheet pdf and Memory product details from Samsung Semiconductor stock available at utmel
1最小包装量--
K4B2G1646F-BMMATCV详情
Samsung Semiconductor K4B2G1646F-BMMATCV重要参数规格及、参数值,及相似型号如下:
- 参数名参数值全选
- 参数名参数值全选
EU RoHS
Compliant
ECCN (US)
EAR99
Automotive
无
PPAP
无
DRAM Type
DDR3L SDRAM
Chip Density (bit)
2G
Number of Internal Banks
8
Number of Words per Bank
16M
Number of Bits/Word (bit)
16
Data Bus Width (bit)
16
Maximum Clock Rate (MHz)
1866
Maximum Access Time (ns)
0.195
Address Bus Width (bit)
17
Minimum Operating Supply Voltage (V)
1.283|1.425
Typical Operating Supply Voltage (V)
1.35|1.5
Maximum Operating Supply Voltage (V)
1.575|1.45
Operating Current (mA)
134
Minimum Operating Temperature (°C)
-40
Maximum Operating Temperature (°C)
95
Supplier Temperature Grade
Industrial
Number of I/O Lines (bit)
16
Mounting
表面贴装
Package Width
7.5
Package Length
13.3
PCB changed
96
Supplier Package
FBGA
零件状态
LTB
引脚数量
96
组织结构
128Mx16
K4B2G1646F-BMMATCV拓展信息
Samsung
Samsung
Samsung
Samsung
Samsung
Samsung
Samsung
Samsung
Samsung
Samsung Semiconductor







哦! 它是空的。