Samsung Semiconductor K4D55323QF-VC2A

表面安装

YES

终端数量

144

Rohs Code

有

Part Life Cycle Code

Obsolete

Ihs Manufacturer

SAMSUNG SEMICONDUCTOR INC

Package Description

FBGA, BGA144,12X12,32

Access Time-Max

0.55 ns

Clock Frequency-Max (fCLK)

350 MHz

Moisture Sensitivity Levels

3

Number of Words

8388608 words

Number of Words Code

8000000

Operating Temperature-Max

65 °C

Package Body Material

PLASTIC/EPOXY

Package Code

FBGA

Package Equivalence Code

BGA144,12X12,32

Package Shape

SQUARE

Package Style

GRID ARRAY, FINE PITCH

Supply Voltage-Nom (Vsup)

1.8 V

ECCN 代码

EAR99

HTS代码

8542.32.00.24

端子位置

BOTTOM

终端形式

BALL

峰值回流焊温度（摄氏度）

260

端子间距

0.8 mm

Reach合规守则

compliant

JESD-30代码

S-PBGA-B144

资历状况

不合格

温度等级

COMMERCIAL

组织结构

8MX32

输出特性

3-STATE

内存宽度

32

记忆密度

268435456 bit

I/O类型

COMMON

内存IC类型

GDDR1 DRAM

刷新周期

4096

顺序突发长度

4