Samsung Semiconductor K4FBE3D4HM-GHCL02V

ECCN (US)

EAR99

HTS

8542.32.00.36

DRAM Type

Mobile LPDDR4 SDRAM

Chip Density (bit)

32G

Number of Bits/Word (bit)

32

Data Bus Width (bit)

32

Maximum Clock Rate (MHz)

4266

Typical Operating Supply Voltage (V)

1.1|1.8

Minimum Operating Temperature (°C)

-40

Maximum Operating Temperature (°C)

105

Number of I/O Lines (bit)

32

Mounting

表面贴装

PCB changed

200

Supplier Package

FPGA

零件状态

活跃

引脚数量

200

组织结构

1Gx32