Samsung Semiconductor K4RAH165VB-BCQK

Contact plating

gold-plated

表面安装

YES

Number of pins

28

终端数量

106

Type of connector

pin strips

Connector

socket

Kind of connector

female

Spatial orientation

straight

Contacts pitch

2.54mm

Electrical mounting

THT

Connector pinout layout

1x28

Gross weight

1.62 g

Part Life Cycle Code

活跃

Ihs Manufacturer

SAMSUNG SEMICONDUCTOR INC

Package Description

FBGA-106

Number of Words

1073741824 words

Number of Words Code

1000000000

Operating Temperature-Max

85 °C

Package Body Material

PLASTIC/EPOXY

Package Code

BGA

Package Shape

RECTANGULAR

Package Style

网格排列

Supply Voltage-Nom (Vsup)

1.1 V

Operating temperature

-40...163°C

端子位置

BOTTOM

终端形式

BALL

功能数量

1

Reach合规守则

unknown

Current rating

1.5A

JESD-30代码

R-PBGA-B106

操作模式

ASYNCHRONOUS

组织结构

1GX16

内存宽度

16

记忆密度

17179869184 bit

内存IC类型

DDR5 DRAM

Rated voltage

60V

个人资料

beryllium copper

Plating thickness

0.75µm

Flammability rating

UL94V-0