Samsung Semiconductor K4S280832O-LC60

表面安装

YES

终端数量

54

EU RoHS

Compliant

ECCN (US)

EAR99

Automotive

无

PPAP

无

DRAM Type

SDRAM

Chip Density (bit)

128M

Number of Internal Banks

4

Number of Words per Bank

4M

Number of Bits/Word (bit)

8

Data Bus Width (bit)

8

Maximum Clock Rate (MHz)

333

Maximum Access Time (ns)

5

Address Bus Width (bit)

13

Interface Type

LVTTL

Minimum Operating Supply Voltage (V)

3

Typical Operating Supply Voltage (V)

3.3

Maximum Operating Supply Voltage (V)

3.6

Operating Current (mA)

60

Minimum Operating Temperature (°C)

0

Maximum Operating Temperature (°C)

70

Number of I/O Lines (bit)

8

Mounting

表面贴装

Package Height

1

Package Width

10.16

Package Length

22.62(Max)

PCB changed

54

Standard Package Name

SOP

Supplier Package

TSOP-II

Lead Shape

Gull-wing

Package Description

TSOP, TSOP54,.46,32

Package Style

SMALL OUTLINE, THIN PROFILE

Number of Words Code

16000000

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

TSOP54,.46,32

Access Time-Max

5 ns

Operating Temperature-Max

85 °C

Rohs Code

有

Manufacturer Part Number

K4S280832O-LC60

Clock Frequency-Max (fCLK)

166 MHz

Number of Words

16777216 words

Supply Voltage-Nom (Vsup)

3.3 V

Package Code

TSOP

Package Shape

RECTANGULAR

Manufacturer

三星半导体

Part Life Cycle Code

Obsolete

Ihs Manufacturer

SAMSUNG SEMICONDUCTOR INC

Risk Rank

5.84

零件状态

Obsolete

子类别

DRAMs

技术

CMOS

端子位置

DUAL

终端形式

鸥翼

端子间距

0.8 mm

Reach合规守则

unknown

引脚数量

54

JESD-30代码

R-PDSO-G54

资历状况

不合格

电源

3.3 V

温度等级

OTHER

电源电流-最大值

0.06 mA

组织结构

16Mx8

输出特性

3-STATE

内存宽度

8

待机电流-最大值

0.002 A

记忆密度

134217728 bit

I/O类型

COMMON

内存IC类型

同步剧

刷新周期

4096

顺序突发长度

1,2,4,8,FP

交错突发长度

1,2,4,8