Samsung Semiconductor K4T51163QC-ZCD5000

底架

表面贴装

引脚数

84

EU RoHS

Compliant

ECCN (US)

EAR99

HTS

8542.32.00.28

Automotive

无

PPAP

无

DRAM Type

DDR2 SDRAM

Chip Density (bit)

512M

Number of Internal Banks

4

Number of Words per Bank

8M

Number of Bits/Word (bit)

16

Data Bus Width (bit)

16

Maximum Clock Rate (MHz)

533

Maximum Access Time (ns)

0.5

Address Bus Width (bit)

15

Interface Type

SSTL_1.8

Minimum Operating Supply Voltage (V)

1.7

Typical Operating Supply Voltage (V)

1.8

Maximum Operating Supply Voltage (V)

1.9

Operating Current (mA)

160

Minimum Operating Temperature (°C)

0

Maximum Operating Temperature (°C)

95

Supplier Temperature Grade

Commercial

Number of I/O Lines (bit)

16

Mounting

表面贴装

Package Height

0.8(Max)

Package Width

11

Package Length

13

PCB changed

84

Standard Package Name

BGA

Supplier Package

FBGA

Lead Shape

Ball

RoHS

Compliant

Current - Supply (Nom)

160 mA

包装

卷带

零件状态

Obsolete

最高工作温度

95 °C

最小工作温度

0 °C

电压 - 供电

1.8 V

访问时间

500 ps

组织结构

32Mx16

地址总线宽度

15 b

密度

512 Mb

最高频率

533 MHz

电压 - 供电 （最大值）

1.9 V

电压 - 供电 （最小值）

1.7 V