Samsung Semiconductor K4T51163QG-HCE6000

EU RoHS

Compliant

ECCN (US)

EAR99

Automotive

无

PPAP

无

DRAM Type

DDR2 SDRAM

Chip Density (bit)

512M

Number of Internal Banks

4

Number of Words per Bank

8M

Number of Bits/Word (bit)

16

Data Bus Width (bit)

16

Maximum Clock Rate (MHz)

667

Maximum Access Time (ns)

0.45

Address Bus Width (bit)

15

Interface Type

SSTL_18

Minimum Operating Supply Voltage (V)

1.7

Typical Operating Supply Voltage (V)

1.8

Maximum Operating Supply Voltage (V)

1.9

Operating Current (mA)

165

Minimum Operating Temperature (°C)

0

Maximum Operating Temperature (°C)

95

Supplier Temperature Grade

Commercial

Number of I/O Lines (bit)

16

Mounting

表面贴装

Package Height

0.95

Package Width

7.5

Package Length

12.5

PCB changed

84

Standard Package Name

BGA

Supplier Package

FBGA

Lead Shape

Ball

包装

卷带

零件状态

Obsolete

引脚数量

84

组织结构

32Mx16