Samsung Semiconductor K4T51163QG-HCF7000

引脚数

84

ECCN (US)

EAR99

Automotive

无

PPAP

无

DRAM Type

DDR2 SDRAM

Chip Density (bit)

512M

Number of Internal Banks

4

Number of Words per Bank

8M

Number of Bits/Word (bit)

16

Data Bus Width (bit)

16

Maximum Clock Rate (MHz)

800

Maximum Access Time (ns)

0.45

Address Bus Width (bit)

16

Interface Type

SSTL_18

Minimum Operating Supply Voltage (V)

1.7

Typical Operating Supply Voltage (V)

1.8

Maximum Operating Supply Voltage (V)

1.9

Operating Current (mA)

165

Minimum Operating Temperature (°C)

0

Maximum Operating Temperature (°C)

70

Supplier Temperature Grade

Commercial

Number of I/O Lines (bit)

16

Mounting

表面贴装

Package Width

9

Package Length

13

PCB changed

84

Standard Package Name

BGA

Supplier Package

FBGA

Lead Shape

Ball

包装

Tray

零件状态

Obsolete

组织结构

32Mx16