Samsung Semiconductor KLMBG2JETD-B0410

表面安装

YES

终端数量

153

EU RoHS

Compliant

ECCN (US)

3A991.b.1.a

HTS

8542.32.00.71

Automotive

无

PPAP

无

Cell Type

MLC NAND

Chip Density (bit)

256G

Programmability

有

Timing Type

Synchronous

Interface Type

Serial e-MMC

Minimum Operating Supply Voltage (V)

1.7|2.7

Typical Operating Supply Voltage (V)

1.8|3.3

Maximum Operating Supply Voltage (V)

1.95|3.6

Command Compatible

无

ECC Support

无

Support of Page Mode

无

Package Description

FBGA-153

Package Style

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Number of Words Code

32000000000

Package Body Material

PLASTIC/EPOXY

Operating Temperature-Min

-25 °C

Operating Temperature-Max

85 °C

Manufacturer Part Number

KLMBG2JETD-B0410

Clock Frequency-Max (fCLK)

200 MHz

Number of Words

34359738368 words

Supply Voltage-Nom (Vsup)

1.8 V

Package Code

VFBGA

Package Shape

RECTANGULAR

Manufacturer

三星半导体

Part Life Cycle Code

活跃

Ihs Manufacturer

SAMSUNG SEMICONDUCTOR INC

Risk Rank

5.79

零件状态

Unconfirmed

类型

MLC NAND TYPE

附加功能

ALSO OPERATES @ 3V SUP NOM

技术

CMOS

端子位置

BOTTOM

终端形式

BALL

功能数量

1

端子间距

0.5 mm

Reach合规守则

compliant

JESD-30代码

R-PBGA-B153

电源电压-最大值(Vsup)

1.95 V

温度等级

OTHER

电源电压-最小值(Vsup)

1.7 V

操作模式

SYNCHRONOUS

建筑学

Sectored

组织结构

32GX8

座位高度-最大

0.8 mm

内存宽度

8

记忆密度

274877906944 bit

并行/串行

PARALLEL

内存IC类型

FLASH

编程电压

1.8 V

引导模块

无

宽度

11.5 mm

长度

13 mm