Samsung Semiconductor KLMDG8JENB-B0410

表面安装

YES

终端数量

153

HTS

8542.32.00.71

Automotive

无

PPAP

无

Chip Density (bit)

1T

Timing Type

Synchronous

Interface Type

Serial e-MMC

Minimum Operating Supply Voltage (V)

1.7|2.7

Typical Operating Supply Voltage (V)

1.8|3.3

Maximum Operating Supply Voltage (V)

1.95|3.6

Package Height

1

Package Width

11.5

Package Length

13

Package Description

FBGA-153

Package Style

GRID ARRAY, THIN PROFILE, FINE PITCH

Number of Words Code

128000000000

Package Body Material

PLASTIC/EPOXY

Operating Temperature-Min

-25 °C

Operating Temperature-Max

85 °C

Manufacturer Part Number

KLMDG8JENB-B0410

Clock Frequency-Max (fCLK)

200 MHz

Number of Words

137438953472 words

Supply Voltage-Nom (Vsup)

1.8 V

Package Code

TFBGA

Package Shape

RECTANGULAR

Manufacturer

三星半导体

Part Life Cycle Code

活跃

Ihs Manufacturer

SAMSUNG SEMICONDUCTOR INC

Risk Rank

5.78

零件状态

Unconfirmed

类型

MLC NAND TYPE

技术

CMOS

端子位置

BOTTOM

终端形式

BALL

功能数量

1

端子间距

0.5 mm

Reach合规守则

compliant

JESD-30代码

R-PBGA-B153

电源电压-最大值(Vsup)

1.95 V

温度等级

OTHER

电源电压-最小值(Vsup)

1.7 V

操作模式

SYNCHRONOUS

组织结构

128GX8

座位高度-最大

1.2 mm

内存宽度

8

记忆密度

1099511627776 bit

并行/串行

PARALLEL

内存IC类型

FLASH

编程电压

1.8 V

宽度

11.5 mm

长度

13 mm