Samsung Semiconductor M378A5244BB0-CTD00

ECCN (US)

EAR99

HTS

8473.30.11.40

Automotive

无

PPAP

无

Module

DRAM模块

Module Density

4Gbyte

Number of Chip per Module

4

Chip Density (bit)

8G

Data Bus Width (bit)

64

Maximum Clock Rate (MHz)

2666

Chip Configuration

512Mx16

Chip Package Type

78FBGA

Minimum Operating Supply Voltage (V)

1.14

Typical Operating Supply Voltage (V)

1.2

Maximum Operating Supply Voltage (V)

1.26

Operating Current (mA)

780

ECC Support

无

Number of Ranks

Single

CAS Latency

19

Mounting

Socket

Package Height

31.25

Package Width

2.61(Max)

Package Length

133.35

PCB changed

288

Supplier Package

UDIMM

零件状态

LTB

引脚数量

288

组织结构

512Mx64

模块类型

288UDIMM