Samsung Semiconductor M386A8K40CM2-CVFB0

ECCN (US)

4A994.a

Automotive

无

PPAP

无

Module

DRAM模块

Module Density

64Gbyte

Number of Chip per Module

36

Chip Density (bit)

16G

Data Bus Width (bit)

72

Max. Access Time (ns)

0.165

Maximum Clock Rate (MHz)

2933

Chip Configuration

4Gx4

Chip Package Type

78FBGA

Minimum Operating Supply Voltage (V)

1.14

Typical Operating Supply Voltage (V)

1.2

Maximum Operating Supply Voltage (V)

1.26

Minimum Operating Temperature (°C)

0

Maximum Operating Temperature (°C)

85

Supplier Temperature Grade

Commercial

Module Sides

Double

ECC Support

有

Number of Ranks

Quad

Number of Chip Banks

16

CAS Latency

21

SPD EEPROM Support

无

Mounting

Socket

Package Height

31.25

Package Width

4.3(Max)

Package Length

133.35

PCB changed

288

Supplier Package

LRDIMM

零件状态

Obsolete

引脚数量

288

组织结构

8Gx72

锁相环

无

自我刷新

有

模块类型

288LRDIMM