Samsung Semiconductor M386B4G70DM0-YH9

EU RoHS

供应商未确认

ECCN (US)

4A994.a

Automotive

无

PPAP

无

Module

DRAM模块

Module Density

32Gbyte

Number of Chip per Module

36

Chip Density (bit)

8G

Data Bus Width (bit)

72

Maximum Clock Rate (MHz)

1333

Chip Configuration

2Gx4

Chip Package Type

78FBGA

Typical Operating Supply Voltage (V)

1.35

Minimum Operating Temperature (°C)

0

Maximum Operating Temperature (°C)

85

Supplier Temperature Grade

Commercial

Module Sides

Double

ECC Support

无

Number of Ranks

Quad

CAS Latency

9

零件状态

Obsolete

组织结构

4Gx72

模块类型

240LRDIMM