Samsung Semiconductor M391B1G73QH0-YK0

EU RoHS

Compliant

HTS

8542.32.00.71

Automotive

无

PPAP

无

Module

DRAM模块

Module Density

8Gbyte

Number of Chip per Module

18

Chip Density (bit)

4G

Data Bus Width (bit)

72

Max. Access Time (ns)

0.225

Maximum Clock Rate (MHz)

1600

Chip Configuration

512Mx8

Chip Package Type

78FBGA

Minimum Operating Supply Voltage (V)

1.283

Typical Operating Supply Voltage (V)

1.35

Maximum Operating Supply Voltage (V)

1.45

Operating Current (mA)

1125

Minimum Operating Temperature (°C)

0

Maximum Operating Temperature (°C)

95

Module Sides

Double

ECC Support

有

Number of Ranks

Dual

Number of Chip Banks

8

CAS Latency

11

SPD EEPROM Support

有

Mounting

Socket

Package Height

30

Package Width

4(Max)

Package Length

133.35

PCB changed

240

Supplier Package

UDIMM

零件状态

Obsolete

引脚数量

240

组织结构

1Gx72

锁相环

无

自我刷新

有

模块类型

240UDIMM