Samsung Semiconductor M393B4G70DM0-YH9

EU RoHS

Compliant

Automotive

无

PPAP

无

Module

DRAM模块

Module Density

32Gbyte

Number of Chip per Module

36

Chip Density (bit)

8G

Data Bus Width (bit)

72

Max. Access Time (ns)

0.255

Maximum Clock Rate (MHz)

1333

Chip Configuration

2Gx4

Chip Package Type

78FBGA

Minimum Operating Supply Voltage (V)

1.283

Typical Operating Supply Voltage (V)

1.35

Maximum Operating Supply Voltage (V)

1.45

Minimum Operating Temperature (°C)

0

Maximum Operating Temperature (°C)

95

Module Sides

Double

ECC Support

无

Number of Ranks

Quad

Number of Chip Banks

8

CAS Latency

9

SPD EEPROM Support

有

Mounting

Socket

PCB changed

240

Supplier Package

RDIMM

零件状态

Obsolete

引脚数量

240

组织结构

4Gx72

锁相环

无

自我刷新

有

模块类型

240RDIMM