Winbond Electronics Corporation W89C926F
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W89C926F
2736-W89C926F
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W89C926F datasheet pdf and Integrated Circuits (ICs) product details from Winbond Electronics Corporation stock available at utmel
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W89C926F详情
Winbond Electronics Corporation W89C926F重要参数规格及、参数值,及相似型号如下:
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表面安装
YES
终端数量
100
Manufacturer Part Number
W89C926F
Part Life Cycle Code
Obsolete
Ihs Manufacturer
WINBOND ELECTRONICS CORP
Part Package Code
QFP
Package Description
LQFP,
Risk Rank
5.83
Operating Temperature-Max
70 °C
Package Body Material
PLASTIC/EPOXY
Package Code
LQFP
Package Shape
RECTANGULAR
Package Style
FLATPACK, LOW PROFILE
Supply Voltage-Max
5.25 V
Supply Voltage-Nom
5 V
Supply Voltage-Min
4.75 V
HTS代码
8542.31.00.01
端子位置
QUAD
终端形式
鸥翼
端子间距
0.65 mm
Reach合规守则
unknown
引脚数量
100
JESD-30代码
R-PQFP-G100
资历状况
不合格
温度等级
COMMERCIAL
uPs/uCs/外围ICs类型
SERIAL IO/COMMUNICATION CONTROLLER, LAN
座位高度-最大
1.6 mm
地址总线宽度
16
外部数据总线宽度
16
串行I/O数
2
总线兼容性
PCMCIA
数据编码/解码方式
NRZ
长度
20 mm
宽度
14 mm
W89C926F拓展信息
Winbond Electronics Corporation
Winbond Electronics Corporation
Winbond Electronics Corporation
Winbond Electronics Corporation
Winbond Electronics Corporation
Winbond Electronics Corporation
Winbond Electronics Corporation
Winbond Electronics Corporation
Winbond Electronics Corporation
Winbond Electronics Corporation







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