Winbond Electronics Corporation ISD33240E
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ISD33240E
2736-ISD33240E
集成电路(IC)
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ISD33240E datasheet pdf and Integrated Circuits (ICs) product details from Winbond Electronics Corporation stock available at utmel
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ISD33240E详情
Winbond Electronics Corporation ISD33240E重要参数规格及、参数值,及相似型号如下:
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表面安装
YES
终端数量
28
Manufacturer Part Number
ISD33240E
Rohs Code
无
Part Life Cycle Code
Obsolete
Ihs Manufacturer
INFORMATION STORAGE DEVICES
Package Description
TSSOP, TSSOP28,.53,22
Risk Rank
5.87
Package Body Material
PLASTIC/EPOXY
Package Code
TSSOP
Package Equivalence Code
TSSOP28,.53,22
Package Shape
RECTANGULAR
Package Style
小概要
Reflow Temperature-Max (s)
未说明
JESD-609代码
e0
端子表面处理
Tin/Lead (Sn/Pb)
HTS代码
8542.39.00.01
端子位置
DUAL
终端形式
鸥翼
峰值回流焊温度(摄氏度)
未说明
端子间距
0.55 mm
Reach合规守则
unknown
JESD-30代码
R-PDSO-G28
资历状况
不合格
电源
3 V
电源电流-最大值
40 mA
消费者集成电路类型
语音合成器
阅读时间-最大
249.9 s
ISD33240E拓展信息
Winbond Electronics Corporation
Winbond Electronics Corporation
Winbond Electronics Corporation
Winbond Electronics Corporation
Winbond Electronics Corporation
Winbond Electronics Corporation
Winbond Electronics Corporation
Winbond Electronics Corporation
Winbond Electronics Corporation
Winbond Electronics Corporation







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