类别是'category.片上系统(SoC)' (7720)
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对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 包装/外壳 | 表面安装 | 供应商器件包装 | 终端数量 | # Application Cores / # Real-Time Cores | 100G Multirate Ethernet MAC | 14-bit RF-ADC # of ADCs | 14-bit RF-ADC Max Sample Rate (GSPS) | 14-bit RF-DAC # of DACs | 14-bit RF-DAC Max Sample Rate (GSPS) | 400G High-Speed Crypto Engines | 600G Ethernet MAC | AI Engine Tiles | AIE-ML v2 Tiles | Application Cores / Real-Time Cores | Application Cores Core Details | Application Cores Cores per Cluster / # Clusters | Application Processing Unit | Application Processor | Channelizer | DDR Memory Controllers | DSP Engines | DSP58 | FFT/iFFT | General Connectivity | GPU | GPU Cores (Arm Mali-G78AE) | GTM Transceivers (56G (112G)) | GTM2 CPM6 32G (64G)8, 9 | GTM2 PL Only 56G (112G)7, 8 | GTMP Transceivers (56G (112G)) | GTYP Transceivers | GTYP Transceivers (PL-Only) | High-Performance I/O | High-Performance I/O (X5IO) | High-Speed Connectivity | High-Speed Crypto Engine (HSC) | Image Signal Processor (ISP) Tiles | INT8 TOPS (Dense) | INT8 TOPS (Max Sparsity) | Integrated Memory on Package (LPDDR5X) | L3 Cache per Cluster (MB) | LDPC Decoder | Max. Memory Bandwidth (LPDDR5X) | 厂商 | MX6 TOPS (Dense) | On-Chip Memory w/ECC (MB) | PCI Express® | PCIe® w/ DMA & CXL® 3.1 (CPM6) | PL PCIe (Gen5 x4) | PL PCIe (Gen5x4) | Poly Block | Real-Time Cores Core Details | Real-Time Cores Cores per Cluster / # Clusters | Real-Time Processing Unit | Real-Time Processor | System Logic Cells | Total PL Memory (Mb) | Total PL Memory6(Mb) | Video Codec Unit (VCU) Tiles | 操作温度 | 包装 | 系列 | 零件状态 | 类型 | HTS代码 | 子类别 | 技术 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 端子间距 | Reach合规守则 | 引脚数量 | 终端样式 | JESD-30代码 | 输出的数量 | 资历状况 | 执行器类型 | 电源 | 温度等级 | 速度 | 内存大小 | 核心处理器 | 极数 | 周边设备 | 程序内存大小 | 连接方式 | 建筑学 | 输入数量 | 座位高度-最大 | 可编程逻辑类型 | 产品类别 | 筛选水平 | 速度等级 | 主要属性 | 寄存器数量 | 逻辑单元数 | 核数量 | 闪光大小 | 产品 | 产品类别 | LUTs(图形用户界面) | 长度 | 宽度 | |||||||||||||||||||||||||||||||||||||||||||||||||
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![]() | XC7Z035-1FFG900I | AMD | 数据表 | 573 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | 1.05 V | 表面贴装 | 130 | Tray | XC7Z035 | 活跃 | Industrial grade | AMD | 275,000 | FCBGA | 1.0000 V | 0.95 V | 362 | -40 to 100 °C | Zynq®-7000 | 900 | 667MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Industrial | 1 | Kintex™-7 FPGA, 275K Logic Cells | 343,800 | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGIB019R18A2I3E | Intel | 数据表 | 760 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1805-BBGA Exposed Pad | 1805-BGA (42.5x42.5) | 480 | -40°C ~ 100°C (TJ) | Tray | Agilex I | 活跃 | 1.4GHz | 256KB | Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.9M Logic Elements | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | SOM-2533AN0C-S0A1 | Advantech Corp | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Module | 8 | 0°C ~ 60°C | Box | SMARC | 活跃 | 3.4GHz | 4GB | Intel® N50 | HDMI, LCD, LVDS, SATA | CANbus, Ethernet, I2C, I2S, MMC/SD/SDIO, PCIe, SPDIF, SPI, UART, USB | MPU | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AMA3B1KK-KQR-B0 | Ambiq Micro, Inc. | 数据表 | 3182 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 64-WFQFN Exposed Pad | 64-QFN (8x8) | 37 | -40°C ~ 85°C (TA) | Tape & Reel (TR);Cut Tape (CT);Digi-Reel® | Apollo3 Blue | 活跃 | 96MHz | 384KB | ARM® Cortex®-M4F | Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT | I2C, SPI, UART/USART | MCU | 1MB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 2VM3104 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 4/6 | 1 | Arm® Cortex®-A78AE, 64 KB I w/parity & D w/ECC L1 Cache, 512 KB L2 Cache | 4/1 | 420 | CAN/CAN-FD, SPI, UART, USB 2.0, I2C/I3C, GPIO | 1 | 4 | 224 | PCI Express® Gen5 x4 , USB 3.2, DisplayPort™ 1.4, 10G Ethernet, 1G Ethernet, UFS 3.1 | 2 | 102 GB/s | 1 | Arm Cortex-R52, 32 KB L1 Cache w/ECC, 128 KB TCM w/ECC | 2/3 | 225400 | 19.1 | 103040 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 2VM3454 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 4/6 | 2 | Arm® Cortex®-A78AE, 64 KB I w/parity & D w/ECC L1 Cache, 512 KB L2 Cache | 4/1 | 1140 | CAN/CAN-FD, SPI, UART, USB 2.0, I2C/I3C, GPIO | 1 | 16 | 224 | PCI Express® Gen5 x4 , USB 3.2, DisplayPort™ 1.4, 10G Ethernet, 1G Ethernet, UFS 3.1 | 1 | 2 | 102 GB/s | 1 | 1 | Arm Cortex-R52, 32 KB L1 Cache w/ECC, 128 KB TCM w/ECC | 2/3 | 564760 | 45.4 | 1 | 258176 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | VR1652 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 2 | 4 | 32 | 8 | 16 | 126 | Application Processing Unit Dual-core Arm® Cortex®-A72, 48 KB/32 KB L1 Cache w/ parity & ECC; 1 MB L2 Cache w/ ECC | 224 | 5 | 2256 | 28 | 8 (4) | 12 | 4 | 1 x Gen5x4 | Real-Time Processing Unit Dual-core Arm Cortex-R5F, 32 KB/32 KB L1 Cache, and 256 KB TCM w/ECC | Memory 256 KB On-Chip Memory w/ECC | 1205400 | 156 | Connectivity Ethernet (x2); UART (x2); CAN-FD (x2); USB 2.0 (x1); SPI (x2); I2C (x2) | 551040 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | VR1902 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 2 | 16 | 8 | 16 | 16 | 3 | 120 | Application Processing Unit Dual-core Arm® Cortex®-A72, 48 KB/32 KB L1 Cache w/ parity & ECC; 1 MB L2 Cache w/ ECC | 320 | 5 | 3976 | 40 | 20 (10) | 6 | 1 x Gen5x4 | 24* | Real-Time Processing Unit Dual-core Arm Cortex-R5F, 32 KB/32 KB L1 Cache, and 256 KB TCM w/ECC | Memory 256 KB On-Chip Memory w/ECC | 2473800 | 189 | Connectivity Ethernet (x2); UART (x2); CAN-FD (x2); USB 2.0 (x1); SPI (x2); I2C (x2) | 1130880 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 2VP3102 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 2 | 2 | 1 | Dual-core Arm® Cortex® A72, 48 KB/32 KB L1 Cache w/ parity & ECC; 1 MB L2 Cache w/ ECC | 3332 | 16 (16) | 16 (12) | 416 | 4 | 137 GB/s | 256 KB On-Chip Memory w/ECC | 2x Gen6x8 | Dual-core Arm Cortex R5F, 32 KB/32 KB L1 Cache, and 256 KB TCM w/ECC | 1407560 | 145 | Ethernet (x2); UART (x2); CAN-FD (x2); USB 2.0 (x1); SPI (x2); I2C (x2) | 643456 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 2VP3202 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 2 | 2 | 2 | Dual-core Arm® Cortex® A72, 48 KB/32 KB L1 Cache w/ parity & ECC; 1 MB L2 Cache w/ ECC | 4004 | 16 (16) | 16 (12) | 416 | 6 | 137 GB/s | 256 KB On-Chip Memory w/ECC | 2x Gen6x8 | Dual-core Arm Cortex R5F, 32 KB/32 KB L1 Cache, and 256 KB TCM w/ECC | 1743560 | 178 | Ethernet (x2); UART (x2); CAN-FD (x2); USB 2.0 (x1); SPI (x2); I2C (x2) | 797056 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 2VP3502 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1 | 1 | 5 | Dual-core Arm® Cortex® A72, 48 KB/32 KB L1 Cache w/ parity & ECC; 1 MB L2 Cache w/ ECC | 2856 | 16 (16) | 56 (56) | 736 | 273 GB/s | 256 KB On-Chip Memory w/ECC | 2x Gen6x8 | Dual-core Arm Cortex R5F, 32 KB/32 KB L1 Cache, and 256 KB TCM w/ECC | 3273480 | 327 | Ethernet (x2); UART (x2); CAN-FD (x2); USB 2.0 (x1); SPI (x2); I2C (x2) | 1496448 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 2VP3602 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1 | 1 | 5 | Dual-core Arm® Cortex® A72, 48 KB/32 KB L1 Cache w/ parity & ECC; 1 MB L2 Cache w/ ECC | 7616 | 16 (16) | 56 (56) | 736 | 273 GB/s | 256 KB On-Chip Memory w/ECC | 2x Gen6x8 | Dual-core Arm Cortex R5F, 32 KB/32 KB L1 Cache, and 256 KB TCM w/ECC | 3273480 | 327 | Ethernet (x2); UART (x2); CAN-FD (x2); USB 2.0 (x1); SPI (x2); I2C (x2) | 1496448 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 2VP3422 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1 | 1 | 3 | Dual-core Arm® Cortex® A72, 48 KB/32 KB L1 Cache w/ parity & ECC; 1 MB L2 Cache w/ ECC | 6080 | 16 (16) | 40 (40) | 32 GB | 307 GB/s | 256 KB On-Chip Memory w/ECC | 2x Gen6x8 | Dual-core Arm Cortex R5F, 32 KB/32 KB L1 Cache, and 256 KB TCM w/ECC | 2561160 | 256 | Ethernet (x2); UART (x2); CAN-FD (x2); USB 2.0 (x1); SPI (x2); I2C (x2) | 1170816 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 2VE3358 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1 | 24 | 8 / 10 | Arm Cortex-A78AE, 64 KB I w/parity & D w/ECC L1 Cache, 512 KB L2 Cache, 1 MB L3 Cache (per 2-core cluster), CMN600 w/4 MB Last-Level Cache (shared) | 184 | CAN/CAN-FD, SPI, UART, USB 2.0, I2C/I3C, GPIO | 1x 4-Core Arm Mali-G78AE GPU | 4 | 260 | PCI Express® Gen5x4, USB 3.2, DisplayPort™ 1.4, 10G Ethernet, 1G Ethernet, UFS 3.1 | 1 | 31 | 61 | 102 GB/s | 61 | 1 | Arm Cortex-R52, 32 KB L1 Cache w/ECC, 128 KB TCM w/ECC | 206920 | 21.1 | 2 MB On-Chip Memory w/ECC | 1 | 94592 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 2VE3504 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1 | 96 | 4 / 4 | Arm Cortex-A78AE, 64 KB I w/parity & D w/ECC L1 Cache, 512 KB L2 Cache, 1 MB L3 Cache (per 2-core cluster), CMN600 w/4 MB Last-Level Cache (shared) | 700 | CAN/CAN-FD, SPI, UART, USB 2.0, I2C/I3C, GPIO | 1x 4-Core Arm Mali-G78AE GPU | 12 | 384 | PCI Express® Gen5x4, USB 3.2, DisplayPort™ 1.4, 10G Ethernet, 1G Ethernet, UFS 3.1 | 0 | 123 | 246 | 136 GB/s | 246 | 3 | Arm Cortex-R52, 32 KB L1 Cache w/ECC, 128 KB TCM w/ECC | 492188 | 23.9 | 2 MB On-Chip Memory w/ECC | 0 | 225000 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 2VE3558 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1 | 96 | 8 / 10 | Arm Cortex-A78AE, 64 KB I w/parity & D w/ECC L1 Cache, 512 KB L2 Cache, 1 MB L3 Cache (per 2-core cluster), CMN600 w/4 MB Last-Level Cache (shared) | 700 | CAN/CAN-FD, SPI, UART, USB 2.0, I2C/I3C, GPIO | 1x 4-Core Arm Mali-G78AE GPU | 12 | 384 | PCI Express® Gen5x4, USB 3.2, DisplayPort™ 1.4, 10G Ethernet, 1G Ethernet, UFS 3.1 | 3 | 123 | 246 | 136 GB/s | 246 | 3 | Arm Cortex-R52, 32 KB L1 Cache w/ECC, 128 KB TCM w/ECC | 492188 | 23.9 | 2 MB On-Chip Memory w/ECC | 1 | 225000 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 2VE3804 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 3 | 144 | 4 / 4 | Arm Cortex-A78AE, 64 KB I w/parity & D w/ECC L1 Cache, 512 KB L2 Cache, 1 MB L3 Cache (per 2-core cluster), CMN600 w/4 MB Last-Level Cache (shared) | 2064 | CAN/CAN-FD, SPI, UART, USB 2.0, I2C/I3C, GPIO | 1x 4-Core Arm Mali-G78AE GPU | 20 | 512 | PCI Express® Gen5x4, USB 3.2, DisplayPort™ 1.4, 10G Ethernet, 1G Ethernet, UFS 3.1 | 0 | 184 | 369 | 170 GB/s | 369 | 4 | Arm Cortex-R52, 32 KB L1 Cache w/ECC, 128 KB TCM w/ECC | 1188040 | 97.0 | 2 MB On-Chip Memory w/ECC | 0 | 543104 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 2VE3858 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 3 | 144 | 8 / 10 | Arm Cortex-A78AE, 64 KB I w/parity & D w/ECC L1 Cache, 512 KB L2 Cache, 1 MB L3 Cache (per 2-core cluster), CMN600 w/4 MB Last-Level Cache (shared) | 2064 | CAN/CAN-FD, SPI, UART, USB 2.0, I2C/I3C, GPIO | 1x 4-Core Arm Mali-G78AE GPU | 20 | 512 | PCI Express® Gen5x4, USB 3.2, DisplayPort™ 1.4, 10G Ethernet, 1G Ethernet, UFS 3.1 | 3 | 184 | 369 | 170 GB/s | 369 | 4 | Arm Cortex-R52, 32 KB L1 Cache w/ECC, 128 KB TCM w/ECC | 1188040 | 97.0 | 2 MB On-Chip Memory w/ECC | 1 | 543104 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU3CG-1SFVC784E | AMD | 数据表 | 2185 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | AMD | Non-Compliant | 252 | Tray | XCZU3 | 活跃 | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC CG | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVE1752-2MLEVSVA1596 | AMD | 数据表 | 615 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1596-BFBGA, FCBGA | Sensata | 不发光 | AIRPAX | AIRPAX | 500 | Tray | 活跃 | AMD | + 85 C | 3.174657 oz | - 40 C | 3 | 面板安装 | IAL/IDL/IML/IUL | Hydraulic-Magnetic | 断路器 | Stud | Handle | 600MHz, 1.4GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | 1 Pole | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | 磁性断路器 | - | 断路器 | 断路器 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU3CG-1SBVA484I | AMD | 数据表 | 2554 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 484-BFBGA, FCBGA | 484-FCBGA (19x19) | 不发光 | AIRPAX | 82 | Tray | XCZU3 | 活跃 | AMD | + 85 C | - 40 C | 3 | 面板安装 | Sensata | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC CG | 断路器 | Push-On | Toggle | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | 2 Pole | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | - | 断路器 | 断路器 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU19EG-2FFVB1517I | AMD | 数据表 | 664 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | AMD | TE Connectivity / AMP | TE Connectivity | 5000 | 644 | Tray | XCZU19 | 活跃 | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | Wire & Cable Management | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Wire Labels & Markers | Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells | - | Wire Labels & Markers | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS016E3F29I1SG | ALTERA | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 780-BBGA, FCBGA | 780-FBGA (29x29) | 288 | Non-Compliant | -40°C ~ 100°C (TJ) | Tray | Arria 10 SX | Discontinued at Digi-Key | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 160K Logic Elements | -- | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS027H3F34I2SG | ALTERA | 数据表 | 590 In Stock |
- | 最小起订量: 1 最小包装量: 1 | FBGA-1152 | YES | 1152 | 384 | 有 | This product may require additional documentation to export from the United States. | 2 x 32 kB | 1.2 GHz | 270000 LE | 1 | SMD/SMT | 33750 LAB | 964831 | Intel | Intel / Altera | Arria 10 SoC | Details | 2 x 32 kB | - | BGA, BGA1152,34X34,40 | 网格排列 | PLASTIC/EPOXY | BGA1152,34X34,40 | -40 °C | 0.9 V | 未说明 | 0.87 V | 100 °C | 有 | 10AS027H3F34I2SG | BGA | SQUARE | 活跃 | INTEL CORP | 0.93 V | 5.45 | -40°C ~ 100°C (TJ) | Tray | Arria 10 SX | 活跃 | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | 未说明 | 1 mm | compliant | S-PBGA-B1152 | 384 | 不合格 | 0.9 V | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 384 | 3.65 mm | 现场可编程门阵列 | SoC FPGA | FPGA - 270K Logic Elements | 270000 | 2 Core | -- | SoC FPGA | 35 mm | 35 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | LH79525N0Q100A0,55 | NXP | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 |
XC7Z035-1FFG900I
AMD
分类:Embedded - System On Chip (SoC)
15,634.664781
AGIB019R18A2I3E
Intel
分类:Embedded - System On Chip (SoC)
158,478.902472
SOM-2533AN0C-S0A1
Advantech Corp
分类:Embedded - System On Chip (SoC)
AMA3B1KK-KQR-B0
Ambiq Micro, Inc.
分类:Embedded - System On Chip (SoC)
22.346356
2VM3104
AMD
分类:Embedded - System On Chip (SoC)
2VM3454
AMD
分类:Embedded - System On Chip (SoC)
VR1652
AMD
分类:Embedded - System On Chip (SoC)
VR1902
AMD
分类:Embedded - System On Chip (SoC)
2VP3102
AMD
分类:Embedded - System On Chip (SoC)
2VP3202
AMD
分类:Embedded - System On Chip (SoC)
2VP3502
AMD
分类:Embedded - System On Chip (SoC)
2VP3602
AMD
分类:Embedded - System On Chip (SoC)
2VP3422
AMD
分类:Embedded - System On Chip (SoC)
2VE3358
AMD
分类:Embedded - System On Chip (SoC)
2VE3504
AMD
分类:Embedded - System On Chip (SoC)
2VE3558
AMD
分类:Embedded - System On Chip (SoC)
2VE3804
AMD
分类:Embedded - System On Chip (SoC)
2VE3858
AMD
分类:Embedded - System On Chip (SoC)
XCZU3CG-1SFVC784E
AMD
分类:Embedded - System On Chip (SoC)
3,314.975277
XCVE1752-2MLEVSVA1596
AMD
分类:Embedded - System On Chip (SoC)
167,164.747773
XCZU3CG-1SBVA484I
AMD
分类:Embedded - System On Chip (SoC)
3,495.513444
XCZU19EG-2FFVB1517I
AMD
分类:Embedded - System On Chip (SoC)
60,236.919659
10AS016E3F29I1SG
ALTERA
分类:Embedded - System On Chip (SoC)
10AS027H3F34I2SG
ALTERA
分类:Embedded - System On Chip (SoC)
13,079.553478
LH79525N0Q100A0,55
NXP
分类:Embedded - System On Chip (SoC)
