类别是'category.FPGA 评估板' (3802)
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对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 生命周期状态 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 终端数量 | 厂商 | 操作温度 | 包装 | 系列 | JESD-609代码 | 无铅代码 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 功能数量 | 端子间距 | Reach合规守则 | 引脚数量 | JESD-30代码 | 输出的数量 | 资历状况 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 温度等级 | 电源电压-最小值(Vsup) | 界面 | 速度 | 内存大小 | 操作模式 | 核心处理器 | 周边设备 | 程序内存大小 | 传播延迟 | 连接方式 | 电源电流-最大值 | 数据率 | 建筑学 | 输入数量 | 组织结构 | 输出特性 | 座位高度-最大 | 内存宽度 | 可编程逻辑类型 | 逻辑元件/单元数 | 产品类别 | 待机电流-最大值 | 记忆密度 | 总 RAM 位数 | 筛选水平 | I/O类型 | 通信IC类型 | 内存IC类型 | 速度等级 | 输出功能 | 收发器数量 | 宏细胞数 | 主要属性 | CLB-Max的组合延时 | 逻辑块数量 | JTAG BST | 逻辑单元数 | 专用输入数量 | 核数量 | 等效门数 | 系统内可编程 | 闪光大小 | 产品类别 | 长度 | 宽度 | |||||||||||||||||||||||||||||||||||||||||||||
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![]() | XCS30-4PQG240C | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 240 | XCS30-4PQG240C | 有 | Obsolete | XILINX INC | QFP | FQFP, | 5.8 | 166 MHz | 3 | 85 °C | PLASTIC/EPOXY | FQFP | SQUARE | FLATPACK, FINE PITCH | 5.25 V | 5 V | 30 | 4.75 V | e3 | 有 | Matte Tin (Sn) | MAXIMUM USABLE GATES 30000 | 8542.39.00.01 | QUAD | 鸥翼 | 245 | 0.5 mm | compliant | 240 | S-PQFP-G240 | 不合格 | OTHER | 576 CLBS, 10000 GATES | 4.1 mm | 现场可编程门阵列 | 1.2 ns | 576 | 10000 | 32 mm | 32 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC17S50XLPD8I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 8 | 8 | XC17S50XLPD8I | 无 | Obsolete | XILINX INC | DIP | DIP, DIP8,.3 | 5.82 | 10 MHz | 1 | 559232 words | 559232 | 85 °C | -40 °C | PLASTIC/EPOXY | DIP | DIP8,.3 | RECTANGULAR | IN-LINE | 3.3 V | Compliant | e0 | EAR99 | Tin/Lead (Sn85Pb15) | 8542.32.00.61 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | not_compliant | 8 | R-PDIP-T8 | 不合格 | 3.6 V | 3.3 V | INDUSTRIAL | 3 V | Serial | SYNCHRONOUS | 0.005 mA | 559232X1 | 3-STATE | 4.5974 mm | 1 | 0.00005 A | 559232 bit | COMMON | 存储器电路 | 9.3599 mm | 7.62 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC4020XLA-9BG256C | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 256 | XC4020XLA-9BG256C | 无 | Obsolete | XILINX INC | BGA | BGA, | 5.82 | 227 MHz | 3 | 85 °C | PLASTIC/EPOXY | BGA | SQUARE | 网格排列 | 3.6 V | 3.3 V | 30 | 3 V | e0 | 锡铅 | 8542.39.00.01 | BOTTOM | BALL | 225 | 1.27 mm | compliant | 256 | S-PBGA-B256 | 不合格 | OTHER | 784 CLBS, 13000 GATES | 2.55 mm | 现场可编程门阵列 | 1.1 ns | 784 | 13000 | 27 mm | 27 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC4028XL-3HQG304I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 304 | QFP | HFQFP, | 5.8 | 166 MHz | PLASTIC/EPOXY | HFQFP | SQUARE | FLATPACK, HEAT SINK/SLUG, FINE PITCH | 3.6 V | 3.3 V | 3 V | XC4028XL-3HQG304I | 有 | Obsolete | XILINX INC | MAX USABLE 28000 LOGIC GATES | 8542.39.00.01 | QUAD | 鸥翼 | 0.5 mm | compliant | 304 | S-PQFP-G304 | 不合格 | 1024 CLBS, 18000 GATES | 4.5 mm | 现场可编程门阵列 | 1.6 ns | 1024 | 18000 | 40 mm | 40 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCR5032C-6VQ44C | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 44 | XCR5032C-6VQ44C | 无 | Obsolete | XILINX INC | QFP | TQFP, TQFP44,.47SQ,32 | 5.84 | 111 MHz | 3 | 32 | 70 °C | PLASTIC/EPOXY | TQFP | TQFP44,.47SQ,32 | SQUARE | FLATPACK, THIN PROFILE | 5.25 V | 5 V | 4.75 V | YES | 8542.39.00.01 | QUAD | 鸥翼 | 0.8 mm | unknown | 44 | S-PQFP-G44 | 不合格 | 5 V | COMMERCIAL | 6 ns | 2 DEDICATED INPUTS, 32 I/O | 1.2 mm | EE PLD | MACROCELL | 32 | YES | 2 | YES | 10 mm | 10 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC4036XL-3BGG352I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 352 | XC4036XL-3BGG352I | 有 | Obsolete | XILINX INC | BGA | LBGA, | 5.81 | 166 MHz | 3 | PLASTIC/EPOXY | LBGA | SQUARE | GRID ARRAY, LOW PROFILE | 3.6 V | 3.3 V | 40 | 3 V | e1 | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | MAX USABLE 36000 LOGIC GATES | 8542.39.00.01 | BOTTOM | BALL | 260 | 1.27 mm | compliant | 352 | S-PBGA-B352 | 不合格 | 1296 CLBS, 22000 GATES | 1.7 mm | 现场可编程门阵列 | 1.6 ns | 1296 | 22000 | 35 mm | 35 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC4028XL-2BGG352C | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 352 | XC4028XL-2BGG352C | 有 | Obsolete | XILINX INC | BGA | LBGA, | 5.8 | 179 MHz | 3 | 85 °C | PLASTIC/EPOXY | LBGA | SQUARE | GRID ARRAY, LOW PROFILE | 3.6 V | 3.3 V | 30 | 3 V | e1 | 有 | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | MAX USABLE 28000 LOGIC GATES | 8542.39.00.01 | BOTTOM | BALL | 245 | 1.27 mm | compliant | 352 | S-PBGA-B352 | 不合格 | OTHER | 1024 CLBS, 18000 GATES | 1.7 mm | 现场可编程门阵列 | 1.5 ns | 1024 | 18000 | 35 mm | 35 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCS30-3VQG100I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 100 | Obsolete | XILINX INC | QFP | TFQFP, | 5.81 | 3 | PLASTIC/EPOXY | TFQFP | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | 5.5 V | 5 V | 30 | 4.5 V | XCS30-3VQG100I | 有 | e3 | 有 | 哑光锡 | 8542.39.00.01 | QUAD | 鸥翼 | 260 | 0.5 mm | compliant | 100 | S-PQFP-G100 | 不合格 | 576 CLBS, 10000 GATES | 1.2 mm | 现场可编程门阵列 | 576 | 10000 | 14 mm | 14 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC4044XL-1HQG304C | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 304 | Obsolete | XILINX INC | QFP | HFQFP, | 5.81 | 200 MHz | 85 °C | PLASTIC/EPOXY | HFQFP | SQUARE | FLATPACK, HEAT SINK/SLUG, FINE PITCH | 3.6 V | 3.3 V | 3 V | XC4044XL-1HQG304C | 有 | MAX USABLE 44000 LOGIC GATES | 8542.39.00.01 | QUAD | 鸥翼 | 0.5 mm | compliant | 304 | S-PQFP-G304 | 不合格 | OTHER | 1600 CLBS, 27000 GATES | 4.5 mm | 现场可编程门阵列 | 1.3 ns | 1600 | 27000 | 40 mm | 40 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC4062XL-3HQG240I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 240 | XC4062XL-3HQG240I | 有 | Obsolete | XILINX INC | QFP | HFQFP, | 5.79 | 166 MHz | 3 | PLASTIC/EPOXY | HFQFP | SQUARE | FLATPACK, HEAT SINK/SLUG, FINE PITCH | 3.6 V | 3.3 V | 20 | 3 V | e3 | 哑光锡 | MAX USABLE 62000 LOGIC GATES | 8542.39.00.01 | QUAD | 鸥翼 | 245 | 0.5 mm | compliant | 240 | S-PQFP-G240 | 不合格 | 2304 CLBS, 40000 GATES | 4.1 mm | 现场可编程门阵列 | 1.6 ns | 2304 | 40000 | 32 mm | 32 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC2C256-5PQG208C | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 208 | XC2C256-5PQG208C | 有 | Obsolete | XILINX INC | QFP | FQFP, QFP208,1.2SQ,20 | 5.67 | 3 | 173 | 70 °C | PLASTIC/EPOXY | FQFP | QFP208,1.2SQ,20 | SQUARE | FLATPACK, FINE PITCH | 1.9 V | 1.8 V | 40 | 1.7 V | e3 | Matte Tin (Sn) | 真正的数字设计技术 | 8542.39.00.01 | QUAD | 鸥翼 | 245 | 0.5 mm | compliant | 208 | S-PQFP-G208 | 不合格 | 1.5/3.3,1.8 V | COMMERCIAL | 5 ns | 0 DEDICATED INPUTS, 173 I/O | 4.1 mm | 闪存 PLD | MACROCELL | 256 | YES | YES | 28 mm | 28 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XQV1000-4CG560M | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 560 | XQV1000-4CG560M | 无 | Obsolete | XILINX INC | CGA | HCGA, CGA560,33X33,50 | 5.61 | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | HCGA | CGA560,33X33,50 | SQUARE | GRID ARRAY, HEAT SINK/SLUG | 2.625 V | 2.5 V | 未说明 | 2.375 V | Military grade | e0 | 3A001.A.2.C | 锡铅 | 8542.39.00.01 | BOTTOM | UNSPECIFIED | 未说明 | 1.27 mm | compliant | 560 | S-CBGA-X560 | 404 | 不合格 | 1.2/3.6,2.5 V | MILITARY | 404 | 6144 CLBS, 1124022 GATES | 4.9 mm | 现场可编程门阵列 | MIL-PRF-38535 | 0.8 ns | 6144 | 27648 | 1124022 | 42.5 mm | 42.5 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC2V4000-6BF957I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 957 | XC2V4000-6BF957I | 无 | Obsolete | XILINX INC | BGA | 40 X 40 MM, 1.27 MM PITCH, MS-034BAU-1, FLIP CHIP, BGA-957 | 5.82 | 820 MHz | 4 | PLASTIC/EPOXY | BGA | BGA957,31X31,50 | SQUARE | 网格排列 | 1.575 V | 1.5 V | 30 | 1.425 V | e0 | 无 | Tin/Lead (Sn63Pb37) | 8542.39.00.01 | BOTTOM | BALL | 225 | 1.27 mm | not_compliant | 957 | S-PBGA-B957 | 684 | 不合格 | 1.5,1.5/3.3,3.3 V | 684 | 5760 CLBS, 4000000 GATES | 3.5 mm | 现场可编程门阵列 | 0.35 ns | 5760 | 51840 | 4000000 | 40 mm | 40 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC4044XL-1BGG432I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 432 | XC4044XL-1BGG432I | 有 | Obsolete | XILINX INC | BGA | LBGA, | 5.81 | 200 MHz | 3 | PLASTIC/EPOXY | LBGA | SQUARE | GRID ARRAY, LOW PROFILE | 3.6 V | 3.3 V | 30 | 3 V | e1 | 有 | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | MAX USABLE 44000 LOGIC GATES | 8542.39.00.01 | BOTTOM | BALL | 260 | 1.27 mm | compliant | 432 | S-PBGA-B432 | 不合格 | 1600 CLBS, 27000 GATES | 1.7 mm | 现场可编程门阵列 | 1.3 ns | 1600 | 27000 | 40 mm | 40 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC4052XLA-9BG352C | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 352 | 30 | 3.3 V | 3.6 V | GRID ARRAY, LOW PROFILE | SQUARE | LBGA | PLASTIC/EPOXY | 85 °C | 3 | 227 MHz | 5.86 | LBGA, | BGA | XILINX INC | Obsolete | 无 | XC4052XLA-9BG352C | 3 V | e0 | 锡铅 | 8542.39.00.01 | BOTTOM | BALL | 225 | 1.27 mm | compliant | 352 | S-PBGA-B352 | 不合格 | OTHER | 1936 CLBS, 33000 GATES | 1.7 mm | 现场可编程门阵列 | 1.1 ns | 1936 | 33000 | 35 mm | 35 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC4044XL-1HQG208C | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 208 | 30 | 3.3 V | 3.6 V | FLATPACK, HEAT SINK/SLUG, FINE PITCH | SQUARE | HFQFP | PLASTIC/EPOXY | 85 °C | 3 | 200 MHz | 5.81 | HFQFP, | QFP | XILINX INC | Obsolete | 有 | XC4044XL-1HQG208C | 3 V | e3 | 有 | Matte Tin (Sn) | MAX USABLE 44000 LOGIC GATES | 8542.39.00.01 | QUAD | 鸥翼 | 245 | 0.5 mm | compliant | 208 | S-PQFP-G208 | 不合格 | OTHER | 1600 CLBS, 27000 GATES | 4.1 mm | 现场可编程门阵列 | 1.3 ns | 1600 | 27000 | 28 mm | 28 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCS10-3VQG100I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 100 | 5.5 V | 5 V | 40 | TFQFP, | QFP | XILINX INC | Obsolete | 有 | XCS10-3VQG100I | 5.8 | 125 MHz | 3 | PLASTIC/EPOXY | TFQFP | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | 4.5 V | e3 | Matte Tin (Sn) | MAXIMUM USABLE GATES 10000 | QUAD | 鸥翼 | 260 | 0.5 mm | compliant | 100 | S-PQFP-G100 | 不合格 | 196 CLBS, 3000 GATES | 1.2 mm | 现场可编程门阵列 | 1.6 ns | 196 | 3000 | 14 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | CS203-P | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 18 | 70 °C | PLASTIC/EPOXY | DIP | DIP18,.3 | RECTANGULAR | IN-LINE | 5 V | 未说明 | CS203-P | 无 | Obsolete | CRYSTAL SEMICONDUCTOR CORP | 0.300 INCH, PLASTIC, DIP-18 | 5.8 | e0 | Tin/Lead (Sn/Pb) | DUAL | THROUGH-HOLE | 未说明 | 1 | 2.54 mm | unknown | R-PDIP-T18 | 不合格 | 5 V | COMMERCIAL | 0.012 mA | DTMF信号电路 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2GL150T-1FCG1152I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 1152-BBGA, FCBGA | YES | 1152-FCBGA (35x35) | 1152 | 微芯片技术 | M2GL150T-1FCG1152I | 有 | 活跃 | MICROSEMI CORP | 35 X 35 MM, 1 MM PITCH, ROHS COMPLIANT, FBGA-1152 | 5.3 | 4 | PLASTIC/EPOXY | BGA | BGA1152,34X34,40 | SQUARE | 网格排列 | 1.26 V | 1.2 V | 30 | 1.2000 V | 574 | Tray | M2GL150 | 活跃 | 1.14 V | -40 to 100 °C | IGLOO2 | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B1152 | 574 | 不合格 | 1.2 V | 574 | 2.9 mm | 现场可编程门阵列 | 146124 | 5120000 | 1 | 146124 | 35 mm | 35 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2GL010T-1FGG484I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | FBGA-484 | YES | 484-FPBGA (23x23) | 484 | 微芯片技术 | 30 | 233 | Compliant | 有 | 12084 LE | + 100 C | 0.892167 oz | - 40 C | 60 | SMD/SMT | Microchip Technology / Atmel | IGLOO2 | Tray | M2GL010 | 活跃 | 1.14 V | M2GL010T-1FGG484I | 有 | 活跃 | MICROSEMI CORP | 23 X 23 MM, 1 MM PITCH, ROHS COMPLIANT, FBGA-484 | 5.3 | 3 | PLASTIC/EPOXY | BGA | BGA484,22X22,40 | SQUARE | 网格排列 | 1.26 V | 1.2 V | -40°C ~ 100°C (TJ) | Tray | M2GL010T | 100 °C | -40 °C | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B484 | 233 | 不合格 | 1.2 V | 1.2 V | 114 kB | 667 Mb/s | 233 | 2.44 mm | 现场可编程门阵列 | 12084 | FPGA - Field Programmable Gate Array | 933888 | 1 | 4 Transceiver | 12084 | FPGA - Field Programmable Gate Array | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2GL050TS-FGG484I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 484-BGA | YES | 484-FPBGA (23x23) | 484 | 微芯片技术 | 有 | 活跃 | MICROSEMI CORP | BGA, BGA484,22X22,40 | 5.27 | 3 | PLASTIC/EPOXY | BGA | BGA484,22X22,40 | SQUARE | 网格排列 | 1.26 V | 1.2 V | 30 | 267 | Tray | M2GL050 | 活跃 | 1.14 V | M2GL050TS-FGG484I | -40°C ~ 100°C (TJ) | IGLOO2 | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B484 | 267 | 不合格 | 1.2 V | 267 | 2.44 mm | 现场可编程门阵列 | 56340 | 1869824 | 56340 | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S150T-1FCG1152I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1152-BBGA, FCBGA | YES | 1152-FCBGA (35x35) | 1152 | 微芯片技术 | Tray | M2S150 | 活跃 | - | 166 MHz | 146124 LE | SMD/SMT | - | 64 kB | 1.14 V | M2S150T-1FCG1152I | 有 | 活跃 | MICROSEMI CORP | BGA, BGA1152,34X34,40 | 5.77 | 4 | PLASTIC/EPOXY | BGA | BGA1152,34X34,40 | SQUARE | 网格排列 | 1.26 V | 1.2 V | 40 | 574 | -40°C ~ 100°C (TJ) | SmartFusion®2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B1152 | 574 | 不合格 | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 574 | 2.9 mm | 现场可编程门阵列 | 1 | FPGA - 150K Logic Modules | 146124 | 1 Core | 512KB | 35 mm | 35 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2GL010T-1VFG256 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 256-LFBGA | YES | 256-FPBGA (14x14) | 256 | 微芯片技术 | 活跃 | 12084 LE | + 85 C | 0 C | SMD/SMT | M2GL010T-1VFG256 | 有 | 活跃 | MICROSEMI CORP | LFBGA, | 5.27 | 3 | 85 °C | PLASTIC/EPOXY | LFBGA | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | 1.26 V | 1.14 V | 1.2 V | 30 | 138 | Tray | M2GL010 | 0°C ~ 85°C (TJ) | IGLOO2 | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 260 | 0.8 mm | compliant | S-PBGA-B256 | 1.2 V | OTHER | 1.56 mm | 现场可编程门阵列 | 12084 | 933888 | 2 Transceiver | 14 mm | 14 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | LFXP2-17E-7FT256C8W | Lattice Semiconductor | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 256 | LFXP2-17E-7FT256C8W | 无 | Obsolete | LATTICE SEMICONDUCTOR CORP | BGA | 17 X 17 MM, FTBGA-256 | 5.91 | 420 MHz | 3 | 85 °C | PLASTIC/EPOXY | BGA | BGA256,16X16,40 | SQUARE | 网格排列 | 1.26 V | 1.2 V | 30 | 1.14 V | e0 | 无 | EAR99 | Tin/Lead (Sn63Pb37) | 8542.39.00.01 | BOTTOM | BALL | 225 | 1 mm | compliant | 256 | S-PBGA-B256 | 201 | 不合格 | 1.2,1.2/3.3,3.3 V | OTHER | 201 | 2.1 mm | 现场可编程门阵列 | 17000 | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | LFXP2-17E-5FT256C8W | Lattice Semiconductor | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 256 | Obsolete | LATTICE SEMICONDUCTOR CORP | BGA | 17 X 17 MM, FTBGA-256 | 5.91 | 311 MHz | 3 | 85 °C | PLASTIC/EPOXY | BGA | BGA256,16X16,40 | SQUARE | 无 | LFXP2-17E-5FT256C8W | 1.2 V | 1.26 V | 网格排列 | 30 | 1.14 V | e0 | 无 | EAR99 | Tin/Lead (Sn63Pb37) | 8542.39.00.01 | BOTTOM | BALL | 225 | 1 mm | compliant | 256 | S-PBGA-B256 | 201 | 不合格 | 1.2,1.2/3.3,3.3 V | OTHER | 201 | 2.1 mm | 现场可编程门阵列 | 17000 | 17 mm | 17 mm |
XCS30-4PQG240C
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分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
XC17S50XLPD8I
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分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
XC4020XLA-9BG256C
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分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
XC4028XL-3HQG304I
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分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
XCR5032C-6VQ44C
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分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
XC4036XL-3BGG352I
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分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
XC4028XL-2BGG352C
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分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
XCS30-3VQG100I
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分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
XC4044XL-1HQG304C
Xilinx
分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
XC4062XL-3HQG240I
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分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
XC2C256-5PQG208C
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分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
XQV1000-4CG560M
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分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
XC2V4000-6BF957I
Xilinx
分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
XC4044XL-1BGG432I
Xilinx
分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
XC4052XLA-9BG352C
Xilinx
分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
XC4044XL-1HQG208C
Xilinx
分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
XCS10-3VQG100I
Xilinx
分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
CS203-P
Xilinx
分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
M2GL150T-1FCG1152I
Microchip
分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
M2GL010T-1FGG484I
Microchip
分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
M2GL050TS-FGG484I
Microchip
分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
M2S150T-1FCG1152I
Microchip
分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
M2GL010T-1VFG256
Microchip
分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
LFXP2-17E-7FT256C8W
Lattice Semiconductor
分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
LFXP2-17E-5FT256C8W
Lattice Semiconductor
分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
