类别是'category.片上系统(SoC)' (7720)

  • 所有品牌

对比

图片

产品型号

品牌

数据表

库存

价格(含增值税)

数量

Rohs

包装/外壳

表面安装

供应商器件包装

终端数量

# Application Cores / # Real-Time Cores

100G Multirate Ethernet MAC

14-bit RF-ADC # of ADCs

14-bit RF-ADC Max Sample Rate (GSPS)

14-bit RF-DAC # of DACs

14-bit RF-DAC Max Sample Rate (GSPS)

400G High-Speed Crypto Engines

600G Ethernet MAC

AI Engine Tiles

AIE-ML v2 Tiles

Application Cores / Real-Time Cores

Application Cores Core Details

Application Cores Cores per Cluster / # Clusters

Application Processing Unit

Application Processor

Channelizer

DDR Memory Controllers

DSP Engines

DSP58

FFT/iFFT

General Connectivity

GPU

GPU Cores (Arm Mali-G78AE)

GTM Transceivers (56G (112G))

GTM2 CPM6 32G (64G)8, 9

GTM2 PL Only 56G (112G)7, 8

GTMP Transceivers (56G (112G))

GTYP Transceivers

GTYP Transceivers (PL-Only)

High-Performance I/O

High-Performance I/O (X5IO)

High-Speed Connectivity

High-Speed Crypto Engine (HSC)

Image Signal Processor (ISP) Tiles

INT8 TOPS (Dense)

INT8 TOPS (Max Sparsity)

Integrated Memory on Package (LPDDR5X)

L3 Cache per Cluster (MB)

LDPC Decoder

Max. Memory Bandwidth (LPDDR5X)

厂商

MX6 TOPS (Dense)

On-Chip Memory w/ECC (MB)

PCI Express®

PCIe® w/ DMA & CXL® 3.1 (CPM6)

PL PCIe (Gen5 x4)

PL PCIe (Gen5x4)

Poly Block

Real-Time Cores Core Details

Real-Time Cores Cores per Cluster / # Clusters

Real-Time Processing Unit

Real-Time Processor

System Logic Cells

Total PL Memory (Mb)

Total PL Memory6(Mb)

Video Codec Unit (VCU) Tiles

操作温度

包装

系列

零件状态

类型

HTS代码

子类别

技术

端子位置

终端形式

峰值回流焊温度(摄氏度)

端子间距

Reach合规守则

终端样式

JESD-30代码

输出的数量

资历状况

执行器类型

工作电源电压

电源

温度等级

速度

内存大小

核心处理器

极数

周边设备

程序内存大小

连接方式

建筑学

输入数量

座位高度-最大

可编程逻辑类型

产品类别

主要属性

逻辑单元数

核数量

闪光大小

产品

产品类别

LUTs(图形用户界面)

长度

宽度

AGFA006R16A3I3V
AGFA006R16A3I3V
Intel 数据表

697 In Stock

-

最小起订量: 1

最小包装量: 1

-

-

Intel

384

Tray

活跃

-40°C ~ 100°C (TJ)

Agilex F

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 573K Logic Elements

-

XCVM2202-1LSIVSVC2197
XCVM2202-1LSIVSVC2197
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

+ 110 C

- 40 C

700 mV

XCVM1302-1LSENSVF1369
XCVM1302-1LSENSVF1369
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1369-BFBGA

1369-BGA (35x35)

AMD 赛灵思

424

Tray

活跃

0°C ~ 100°C (TJ)

Versal™ Prime

600MHz, 1.3GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ Prime FPGA, 70k Logic Cells

-

5CSEBA6U19I7NTS
5CSEBA6U19I7NTS
ALTERA 数据表

2979 In Stock

-

最小起订量: 1

最小包装量: 1

Tray

*

活跃

2VM3104
2VM3104
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

4/6

1

Arm® Cortex®-A78AE, 64 KB I w/parity & D w/ECC L1 Cache, 512 KB L2 Cache

4/1

420

CAN/CAN-FD, SPI, UART, USB 2.0, I2C/I3C, GPIO

1

4

224

PCI Express® Gen5 x4 , USB 3.2, DisplayPort™ 1.4, 10G Ethernet, 1G Ethernet, UFS 3.1

2

102 GB/s

1

Arm Cortex-R52, 32 KB L1 Cache w/ECC, 128 KB TCM w/ECC

2/3

225400

19.1

103040

2VM3454
2VM3454
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

4/6

2

Arm® Cortex®-A78AE, 64 KB I w/parity & D w/ECC L1 Cache, 512 KB L2 Cache

4/1

1140

CAN/CAN-FD, SPI, UART, USB 2.0, I2C/I3C, GPIO

1

16

224

PCI Express® Gen5 x4 , USB 3.2, DisplayPort™ 1.4, 10G Ethernet, 1G Ethernet, UFS 3.1

1

2

102 GB/s

1

1

Arm Cortex-R52, 32 KB L1 Cache w/ECC, 128 KB TCM w/ECC

2/3

564760

45.4

1

258176

VR1652
VR1652
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

2

4

32

8

16

126

Application Processing Unit Dual-core Arm® Cortex®-A72, 48 KB/32 KB L1 Cache w/ parity & ECC; 1 MB L2 Cache w/ ECC

224

5

2256

28

8 (4)

12

4

Memory 256 KB On-Chip Memory w/ECC

1 x Gen5x4

Real-Time Processing Unit Dual-core Arm Cortex-R5F, 32 KB/32 KB L1 Cache, and 256 KB TCM w/ECC

1205400

156

Connectivity Ethernet (x2); UART (x2); CAN-FD (x2); USB 2.0 (x1); SPI (x2); I2C (x2)

551040

VR1902
VR1902
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

2

16

8

16

16

3

120

Application Processing Unit Dual-core Arm® Cortex®-A72, 48 KB/32 KB L1 Cache w/ parity & ECC; 1 MB L2 Cache w/ ECC

320

5

3976

40

20 (10)

6

Memory 256 KB On-Chip Memory w/ECC

1 x Gen5x4

24*

Real-Time Processing Unit Dual-core Arm Cortex-R5F, 32 KB/32 KB L1 Cache, and 256 KB TCM w/ECC

2473800

189

Connectivity Ethernet (x2); UART (x2); CAN-FD (x2); USB 2.0 (x1); SPI (x2); I2C (x2)

1130880

2VP3102
2VP3102
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

2

2

1

Dual-core Arm® Cortex® A72, 48 KB/32 KB L1 Cache w/ parity & ECC; 1 MB L2 Cache w/ ECC

3332

16 (16)

16 (12)

416

4

137 GB/s

256 KB On-Chip Memory w/ECC

2x Gen6x8

Dual-core Arm Cortex R5F, 32 KB/32 KB L1 Cache, and 256 KB TCM w/ECC

1407560

145

Ethernet (x2); UART (x2); CAN-FD (x2); USB 2.0 (x1); SPI (x2); I2C (x2)

643456

2VP3202
2VP3202
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

2

2

2

Dual-core Arm® Cortex® A72, 48 KB/32 KB L1 Cache w/ parity & ECC; 1 MB L2 Cache w/ ECC

4004

16 (16)

16 (12)

416

6

137 GB/s

256 KB On-Chip Memory w/ECC

2x Gen6x8

Dual-core Arm Cortex R5F, 32 KB/32 KB L1 Cache, and 256 KB TCM w/ECC

1743560

178

Ethernet (x2); UART (x2); CAN-FD (x2); USB 2.0 (x1); SPI (x2); I2C (x2)

797056

2VP3502
2VP3502
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1

1

5

Dual-core Arm® Cortex® A72, 48 KB/32 KB L1 Cache w/ parity & ECC; 1 MB L2 Cache w/ ECC

2856

16 (16)

56 (56)

736

273 GB/s

256 KB On-Chip Memory w/ECC

2x Gen6x8

Dual-core Arm Cortex R5F, 32 KB/32 KB L1 Cache, and 256 KB TCM w/ECC

3273480

327

Ethernet (x2); UART (x2); CAN-FD (x2); USB 2.0 (x1); SPI (x2); I2C (x2)

1496448

2VP3602
2VP3602
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1

1

5

Dual-core Arm® Cortex® A72, 48 KB/32 KB L1 Cache w/ parity & ECC; 1 MB L2 Cache w/ ECC

7616

16 (16)

56 (56)

736

273 GB/s

256 KB On-Chip Memory w/ECC

2x Gen6x8

Dual-core Arm Cortex R5F, 32 KB/32 KB L1 Cache, and 256 KB TCM w/ECC

3273480

327

Ethernet (x2); UART (x2); CAN-FD (x2); USB 2.0 (x1); SPI (x2); I2C (x2)

1496448

2VP3422
2VP3422
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1

1

3

Dual-core Arm® Cortex® A72, 48 KB/32 KB L1 Cache w/ parity & ECC; 1 MB L2 Cache w/ ECC

6080

16 (16)

40 (40)

32 GB

307 GB/s

256 KB On-Chip Memory w/ECC

2x Gen6x8

Dual-core Arm Cortex R5F, 32 KB/32 KB L1 Cache, and 256 KB TCM w/ECC

2561160

256

Ethernet (x2); UART (x2); CAN-FD (x2); USB 2.0 (x1); SPI (x2); I2C (x2)

1170816

2VE3358
2VE3358
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1

24

8 / 10

Arm Cortex-A78AE, 64 KB I w/parity & D w/ECC L1 Cache, 512 KB L2 Cache, 1 MB L3 Cache (per 2-core cluster), CMN600 w/4 MB Last-Level Cache (shared)

184

CAN/CAN-FD, SPI, UART, USB 2.0, I2C/I3C, GPIO

1x 4-Core Arm Mali-G78AE GPU

4

260

PCI Express® Gen5x4, USB 3.2, DisplayPort™ 1.4, 10G Ethernet, 1G Ethernet, UFS 3.1

1

31

61

102 GB/s

61

2 MB On-Chip Memory w/ECC

1

Arm Cortex-R52, 32 KB L1 Cache w/ECC, 128 KB TCM w/ECC

206920

21.1

1

94592

2VE3504
2VE3504
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1

96

4 / 4

Arm Cortex-A78AE, 64 KB I w/parity & D w/ECC L1 Cache, 512 KB L2 Cache, 1 MB L3 Cache (per 2-core cluster), CMN600 w/4 MB Last-Level Cache (shared)

700

CAN/CAN-FD, SPI, UART, USB 2.0, I2C/I3C, GPIO

1x 4-Core Arm Mali-G78AE GPU

12

384

PCI Express® Gen5x4, USB 3.2, DisplayPort™ 1.4, 10G Ethernet, 1G Ethernet, UFS 3.1

0

123

246

136 GB/s

246

2 MB On-Chip Memory w/ECC

3

Arm Cortex-R52, 32 KB L1 Cache w/ECC, 128 KB TCM w/ECC

492188

23.9

0

225000

2VE3558
2VE3558
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1

96

8 / 10

Arm Cortex-A78AE, 64 KB I w/parity & D w/ECC L1 Cache, 512 KB L2 Cache, 1 MB L3 Cache (per 2-core cluster), CMN600 w/4 MB Last-Level Cache (shared)

700

CAN/CAN-FD, SPI, UART, USB 2.0, I2C/I3C, GPIO

1x 4-Core Arm Mali-G78AE GPU

12

384

PCI Express® Gen5x4, USB 3.2, DisplayPort™ 1.4, 10G Ethernet, 1G Ethernet, UFS 3.1

3

123

246

136 GB/s

246

2 MB On-Chip Memory w/ECC

3

Arm Cortex-R52, 32 KB L1 Cache w/ECC, 128 KB TCM w/ECC

492188

23.9

1

225000

2VE3804
2VE3804
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

3

144

4 / 4

Arm Cortex-A78AE, 64 KB I w/parity & D w/ECC L1 Cache, 512 KB L2 Cache, 1 MB L3 Cache (per 2-core cluster), CMN600 w/4 MB Last-Level Cache (shared)

2064

CAN/CAN-FD, SPI, UART, USB 2.0, I2C/I3C, GPIO

1x 4-Core Arm Mali-G78AE GPU

20

512

PCI Express® Gen5x4, USB 3.2, DisplayPort™ 1.4, 10G Ethernet, 1G Ethernet, UFS 3.1

0

184

369

170 GB/s

369

2 MB On-Chip Memory w/ECC

4

Arm Cortex-R52, 32 KB L1 Cache w/ECC, 128 KB TCM w/ECC

1188040

97.0

0

543104

2VE3858
2VE3858
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

3

144

8 / 10

Arm Cortex-A78AE, 64 KB I w/parity & D w/ECC L1 Cache, 512 KB L2 Cache, 1 MB L3 Cache (per 2-core cluster), CMN600 w/4 MB Last-Level Cache (shared)

2064

CAN/CAN-FD, SPI, UART, USB 2.0, I2C/I3C, GPIO

1x 4-Core Arm Mali-G78AE GPU

20

512

PCI Express® Gen5x4, USB 3.2, DisplayPort™ 1.4, 10G Ethernet, 1G Ethernet, UFS 3.1

3

184

369

170 GB/s

369

2 MB On-Chip Memory w/ECC

4

Arm Cortex-R52, 32 KB L1 Cache w/ECC, 128 KB TCM w/ECC

1188040

97.0

1

543104

XCZU3CG-1SFVC784E
XCZU3CG-1SFVC784E
AMD 数据表

2185 In Stock

-

最小起订量: 1

最小包装量: 1

784-BFBGA, FCBGA

784-FCBGA (23x23)

活跃

AMD

Non-Compliant

252

Tray

XCZU3

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC CG

500MHz, 1.2GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 154K+ Logic Cells

-

XCVE1752-2MLEVSVA1596
XCVE1752-2MLEVSVA1596
AMD 数据表

615 In Stock

-

最小起订量: 1

最小包装量: 1

1596-BFBGA, FCBGA

面板安装

Sensata

不发光

AIRPAX

AIRPAX

500

Tray

活跃

AMD

+ 85 C

3.174657 oz

- 40 C

3

IAL/IDL/IML/IUL

Hydraulic-Magnetic

断路器

Stud

Handle

600MHz, 1.4GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

1 Pole

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

磁性断路器

-

断路器

断路器

XCZU3CG-1SBVA484I
XCZU3CG-1SBVA484I
AMD 数据表

2554 In Stock

-

最小起订量: 1

最小包装量: 1

484-BFBGA, FCBGA

484-FCBGA (19x19)

Sensata

不发光

AIRPAX

82

Tray

XCZU3

活跃

AMD

+ 85 C

- 40 C

3

面板安装

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC CG

断路器

Push-On

Toggle

500MHz, 1.2GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

2 Pole

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 154K+ Logic Cells

-

断路器

断路器

XCZU19EG-2FFVB1517I
XCZU19EG-2FFVB1517I
AMD 数据表

664 In Stock

-

最小起订量: 1

最小包装量: 1

1517-BBGA, FCBGA

1517-FCBGA (40x40)

Tray

XCZU19

活跃

AMD

TE Connectivity / AMP

TE Connectivity

5000

644

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

Wire & Cable Management

533MHz, 600MHz, 1.3GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Wire Labels & Markers

Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells

-

Wire Labels & Markers

10AS016E3F29I1SG
10AS016E3F29I1SG
ALTERA 数据表

N/A

-

最小起订量: 1

最小包装量: 1

780-BBGA, FCBGA

780-FBGA (29x29)

288

Non-Compliant

-40°C ~ 100°C (TJ)

Tray

Arria 10 SX

Discontinued at Digi-Key

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

FPGA - 160K Logic Elements

--

10AS027H3F34I2SG
10AS027H3F34I2SG
ALTERA 数据表

590 In Stock

-

最小起订量: 1

最小包装量: 1

FBGA-1152

YES

1152

384

有

This product may require additional documentation to export from the United States.

2 x 32 kB

1.2 GHz

270000 LE

1

SMD/SMT

33750 LAB

964831

Intel

Intel / Altera

Arria 10 SoC

Details

2 x 32 kB

-

BGA, BGA1152,34X34,40

网格排列

PLASTIC/EPOXY

BGA1152,34X34,40

-40 °C

0.9 V

未说明

0.87 V

100 °C

有

10AS027H3F34I2SG

BGA

SQUARE

活跃

INTEL CORP

0.93 V

5.45

-40°C ~ 100°C (TJ)

Tray

Arria 10 SX

活跃

8542.39.00.01

SOC - Systems on a Chip

CMOS

BOTTOM

BALL

未说明

1 mm

compliant

S-PBGA-B1152

384

不合格

0.9 V

INDUSTRIAL

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

-

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

384

3.65 mm

现场可编程门阵列

SoC FPGA

FPGA - 270K Logic Elements

270000

2 Core

--

SoC FPGA

35 mm

35 mm

LH79525N0Q100A0,55
LH79525N0Q100A0,55
NXP 数据表

N/A

-

最小起订量: 1

最小包装量: 1