IDT的存储器_正品采购_价格信息

品牌是'IDT' (6623)

产品型号	品牌	数据表	库存	价格(含增值税)	数量	表面安装	引脚数	终端数量																			JESD-609代码	无铅代码	ECCN 代码	端子表面处理	附加功能	HTS代码	端子位置	终端形式	峰值回流焊温度（摄氏度）	功能数量	端子间距	Reach合规守则	时间@峰值回流温度-最大值(s)	JESD-30代码	资历状况	温度等级	端口的数量	操作模式	电源电流-最大值	组织结构	输出特性	座位高度-最大	内存宽度	待机电流-最大值	记忆密度	筛选水平	并行/串行	I/O类型	内存IC类型	待机电压-最小值	电压 - 供电（最大值）	电压 - 供电（最小值）	输出启用	长度
IDT70V24S25JI	Integrated Device Technology Inc	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	84	84	Obsolete	INTEGRATED DEVICE TECHNOLOGY INC	LCC	QCCJ, LDCC84,1.2SQ	25 ns	1	4096 words	4000	85 °C	-40 °C	PLASTIC/EPOXY	QCCJ	LDCC84,1.2SQ	SQUARE	CHIP CARRIER	3.3 V	无	e0	无	EAR99	Tin/Lead (Sn85Pb15)	INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN	8542.32.00.41	QUAD	J BEND	225	1	2.54 mm	not_compliant	30	S-PQCC-J84	不合格	INDUSTRIAL	2	ASYNCHRONOUS	0.19 mA	4KX16	3-STATE	4.572 mm	16	0.005 A	65536 bit		PARALLEL	COMMON	MULTI-PORT SRAM	3 V	3.6 V	3 V		29.3116 mm	29.3116 mm
IDT70V7288S25PF	Integrated Device Technology Inc	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	100	100	INTEGRATED DEVICE TECHNOLOGY INC	QFP	14 X 14 MM, 1.40 MM HEIGHT, TQFP-100	25 ns	3	65536 words	64000	70 °C	PLASTIC/EPOXY	LFQFP	QFP100,.63SQ,20	SQUARE	FLATPACK, LOW PROFILE, FINE PITCH	3.3 V	无	Obsolete	e0		EAR99	Tin/Lead (Sn85Pb15)		8542.32.00.41	QUAD	鸥翼	240	1	0.5 mm	not_compliant	20	S-PQFP-G100	不合格	COMMERCIAL	2	ASYNCHRONOUS	0.25 mA	64KX16	3-STATE	1.6 mm	16	0.006 A	1048576 bit		PARALLEL	COMMON	MULTI-PORT SRAM	3.14 V	3.465 V	3.135 V		14 mm	14 mm
IDT71V2577S85PF	Integrated Device Technology Inc	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	100	100	Obsolete	INTEGRATED DEVICE TECHNOLOGY INC	QFP	14 X 20 MM, PLASTIC, TQFP-100	8.5 ns	86 MHz	3	131072 words	128000	70 °C	PLASTIC/EPOXY	LQFP	QFP100,.63X.87	RECTANGULAR	FLATPACK, LOW PROFILE	3.3 V	无	e0		3A991.B.2.A	Tin/Lead (Sn85Pb15)	FLOW-THROUGH ARCHITECTURE	8542.32.00.41	QUAD	鸥翼	225	1	0.65 mm	not_compliant	20	R-PQFP-G100	不合格	COMMERCIAL		SYNCHRONOUS	0.18 mA	128KX36	3-STATE	1.6 mm	36	0.03 A	4718592 bit		PARALLEL	COMMON	缓存SRAM	3.14 V	3.465 V	3.135 V		20 mm	14 mm
IDT71321SA55PFG	Integrated Device Technology Inc	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	64	64	LQFP	QFP64,.66SQ,32	SQUARE	FLATPACK, LOW PROFILE	5 V	有	Transferred	INTEGRATED DEVICE TECHNOLOGY INC	QFP	LQFP, QFP64,.66SQ,32	55 ns	3	2048 words	2000	70 °C	PLASTIC/EPOXY	e3	有	EAR99	Matte Tin (Sn) - annealed	自动断电	8542.32.00.41	QUAD	鸥翼	260	1	0.8 mm	compliant	30	S-PQFP-G64	不合格	COMMERCIAL	2	ASYNCHRONOUS	0.155 mA	2KX8	3-STATE	1.6 mm	8	0.015 A	16384 bit		PARALLEL	COMMON	MULTI-PORT SRAM	4.5 V	5.5 V	4.5 V		14 mm	14 mm
IDT7187L25DB	Integrated Device Technology Inc	数据表	N/A	-	最小起订量: 1 最小包装量: 1	NO	22	22	INTEGRATED DEVICE TECHNOLOGY INC	DIP	0.300 INCH, CERAMIC, DIP-22	25 ns	65536 words	64000	125 °C	-55 °C	CERAMIC, GLASS-SEALED	DIP	DIP22,.3	RECTANGULAR	IN-LINE	5 V	无	Obsolete	e0		3A001.A.2.C	锡铅		8542.32.00.41	DUAL	THROUGH-HOLE		1	2.54 mm	not_compliant		R-GDIP-T22	不合格	MILITARY	1	ASYNCHRONOUS	0.11 mA	64KX1	3-STATE	5.08 mm	1	0.0006 A	65536 bit	MIL-STD-883 Class B	PARALLEL	SEPARATE	标准SRAM	2 V	5.5 V	4.5 V	NO	27.051 mm	7.62 mm
IDT70T3519S133BCG	Integrated Device Technology Inc	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	256	256	262144 words	有	Transferred	INTEGRATED DEVICE TECHNOLOGY INC	BGA	LBGA, BGA256,16X16,40	15 ns	133 MHz	256000	70 °C	PLASTIC/EPOXY	LBGA	BGA256,16X16,40	SQUARE	GRID ARRAY, LOW PROFILE	2.5 V	3	e1	有	3A991.B.2.A	Tin/Silver/Copper (Sn/Ag/Cu)	PIPELINED OR FLOW-THROUGH ARCHITECTURE	8542.32.00.41	BOTTOM	BALL	260	1	1 mm	compliant	30	S-PBGA-B256	不合格	COMMERCIAL	2	SYNCHRONOUS	0.37 mA	256KX36	3-STATE	1.7 mm	36	0.015 A	9437184 bit		PARALLEL	COMMON	MULTI-PORT SRAM	2.4 V	2.6 V	2.4 V		17 mm	17 mm
IDT7165L35J	Integrated Device Technology Inc	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	32	32	INTEGRATED DEVICE TECHNOLOGY INC	QFJ	PLASTIC, LCC-32	35 ns	1	8192 words	8000	70 °C	PLASTIC/EPOXY	QCCJ	LDCC32,.5X.6	RECTANGULAR	CHIP CARRIER	5 V	无	Obsolete	e0		EAR99	锡铅		8542.32.00.41	QUAD	J BEND	225	1	1.27 mm	not_compliant	20	R-PQCC-J32	不合格	COMMERCIAL	1	ASYNCHRONOUS	0.13 mA	8KX8	3-STATE	3.55 mm	8	0.00006 A	65536 bit		PARALLEL	COMMON	标准SRAM	2 V	5.5 V	4.5 V	YES	13.97 mm	11.43 mm
IDT7187L55CB	Integrated Device Technology Inc	数据表	N/A	-	最小起订量: 1 最小包装量: 1	NO	22	22	INTEGRATED DEVICE TECHNOLOGY INC	DIP	DIP, DIP22,.3	55 ns	65536 words	64000	125 °C	-55 °C	CERAMIC, METAL-SEALED COFIRED	DIP	DIP22,.3	RECTANGULAR	IN-LINE	5 V	无	Obsolete	e0	无	3A001.A.2.C	锡铅		8542.32.00.41	DUAL	THROUGH-HOLE		1	2.54 mm	not_compliant		R-CDIP-T22	不合格	MILITARY	1	ASYNCHRONOUS	0.095 mA	64KX1	3-STATE	5.08 mm	1	0.0006 A	65536 bit	38535Q/M;38534H;883B	PARALLEL	SEPARATE	标准SRAM	2 V	5.5 V	4.5 V	NO	27.432 mm	7.62 mm
IDT71256S25L32B	Integrated Device Technology Inc	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	32	32	无	Obsolete	INTEGRATED DEVICE TECHNOLOGY INC	QFJ	LCC-32	25 ns	125 °C	-55 °C	CERAMIC, METAL-SEALED COFIRED	QCCN	LCC32,.45X.55	RECTANGULAR	CHIP CARRIER	5 V	32768 words	32000	e0		3A001.A.2.C	锡铅		8542.32.00.41	QUAD	无铅		1	1.27 mm	not_compliant		R-CQCC-N32	不合格	MILITARY	1	ASYNCHRONOUS	0.15 mA	32KX8	3-STATE	3.048 mm	8	0.02 A	262144 bit	MIL-STD-883 Class B	PARALLEL	COMMON	标准SRAM	4.5 V	5.5 V	4.5 V	YES	13.97 mm	11.43 mm
71V67703S75PF	Integrated Device Technology Inc	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	100	100	7.5 ns	14 X 20 MM, 1.40 MM, PLASTIC, TQFP-100	QFP	INTEGRATED DEVICE TECHNOLOGY INC	Obsolete	无	3.3 V	FLATPACK, LOW PROFILE	RECTANGULAR	QFP100,.63X.87	LQFP	PLASTIC/EPOXY	70 °C	256000	262144 words	3	117 MHz	e0		3A991.B.2.A	Tin/Lead (Sn85Pb15)	FLOW-THROUGH ARCHITECTURE	8542.32.00.41	QUAD	鸥翼	225	1	0.65 mm	not_compliant	20	R-PQFP-G100	不合格	COMMERCIAL		SYNCHRONOUS	0.265 mA	256KX36	3-STATE	1.6 mm	36	0.05 A	9437184 bit		PARALLEL	COMMON	缓存SRAM	3.14 V	3.465 V	3.135 V		20 mm	14 mm
IDT7005L35PFGI	Integrated Device Technology Inc	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	64	64	Transferred	INTEGRATED DEVICE TECHNOLOGY INC	QFP	LQFP, QFP64,.66SQ,32	35 ns	3	8192 words	8000	85 °C	-40 °C	PLASTIC/EPOXY	LQFP	QFP64,.66SQ,32	SQUARE	FLATPACK, LOW PROFILE	5 V	有	e3	有	EAR99	哑光锡		8542.32.00.41	QUAD	鸥翼	260	1	0.8 mm	compliant	40	S-PQFP-G64	不合格	INDUSTRIAL	2	ASYNCHRONOUS	0.25 mA	8KX8	3-STATE	1.6 mm	8	0.004 A	65536 bit		PARALLEL	COMMON	MULTI-PORT SRAM	2 V	5.5 V	4.5 V		14 mm	14 mm
IDT8M624S45CB	Integrated Device Technology Inc	数据表	N/A	-	最小起订量: 1 最小包装量: 1	NO	40	45 ns	65536 words	64000	125 °C	-55 °C	CERAMIC, METAL-SEALED COFIRED	DIP	DIP40,.6	RECTANGULAR	微电子组件	5 V		无	Obsolete	INTEGRATED DEVICE TECHNOLOGY INC	e0		3A001.A.2.C	锡铅	TTL COMPATIBLE INPUTS/OUTPUTS	8542.32.00.41	DUAL	THROUGH-HOLE		1	2.54 mm	not_compliant		R-CDMA-T40	不合格	MILITARY		ASYNCHRONOUS	0.34 mA	64KX16	3-STATE		16	0.08 A	1048576 bit	MIL-STD-883 Class B (Modified)	PARALLEL	COMMON	SRAM MODULE	4.5 V	5.5 V	4.5 V
IDT70P257L55BYGI8	Integrated Device Technology Inc	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	100	100	Obsolete	INTEGRATED DEVICE TECHNOLOGY INC	BGA	6 X 6 MM, 1 MM HEIGHT, 0.50 MM PITCH, GREEN, BGA-100	55 ns	3	8192 words	8000	85 °C	-40 °C	PLASTIC/EPOXY	BGA	BGA100,10X10,20	SQUARE	网格排列	1.8 V	有	e1		EAR99	Tin/Silver/Copper (Sn/Ag/Cu)		8542.32.00.41	BOTTOM	BALL	260	1	0.5 mm	unknown	30	S-PBGA-B100	不合格	INDUSTRIAL	2	ASYNCHRONOUS	0.025 mA	8KX16	3-STATE		16	0.000008 A	131072 bit		PARALLEL	COMMON	MULTI-PORT SRAM	1.7 V	1.9 V	1.7 V
IDT7026L20GB	Integrated Device Technology Inc	数据表	N/A	-	最小起订量: 1 最小包装量: 1	NO	84	84	INTEGRATED DEVICE TECHNOLOGY INC	PGA	PGA, PGA84M,11X11	20 ns	16384 words	16000	125 °C	-55 °C	CERAMIC, METAL-SEALED COFIRED	PGA	PGA84M,11X11	SQUARE	网格排列	5 V	无	Transferred	e0	无	3A001.A.2.C	锡铅	16K X 16 DUAL PORT SRAM	8542.32.00.41	PERPENDICULAR	PIN/PEG		1	2.54 mm	not_compliant		S-CPGA-P84	不合格	MILITARY	2	ASYNCHRONOUS	0.315 mA	16KX16	3-STATE	5.207 mm	16	0.01 A	262144 bit	MIL-PRF-38535	PARALLEL	COMMON	MULTI-PORT SRAM	4.5 V	5.5 V	4.5 V		27.94 mm	27.94 mm
IDT7MMV4101S12BGI	Integrated Device Technology Inc	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	119	119	Obsolete	INTEGRATED DEVICE TECHNOLOGY INC	BGA	PLASTIC, BGA-119	12 ns	3	131072 words	128000	85 °C	-40 °C	PLASTIC/EPOXY	BGA	BGA119,7X17,50	RECTANGULAR	网格排列	3.3 V	无	e0		3A991.B.2.A	锡铅		8542.32.00.41	BOTTOM	BALL	225	1	1.27 mm	not_compliant	20	R-PBGA-B119	不合格	INDUSTRIAL		ASYNCHRONOUS	0.275 mA	128KX24	3-STATE	2.36 mm	24	0.01 A	3145728 bit		PARALLEL	COMMON	标准SRAM	3 V	3.6 V	3 V		22 mm	14 mm
IDT7005S55JB	Integrated Device Technology Inc	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	68	68	1	8192 words	8000	125 °C	-55 °C	PLASTIC/EPOXY	QCCJ	LDCC68,1.0SQ	SQUARE	CHIP CARRIER	无	Transferred	INTEGRATED DEVICE TECHNOLOGY INC	LCC	QCCJ, LDCC68,1.0SQ	5 V	55 ns	e0	无	3A001.A.2.C	锡铅		8542.32.00.41	QUAD	J BEND	225	1	1.27 mm	not_compliant	20	S-PQCC-J68	不合格	MILITARY	2	ASYNCHRONOUS	0.3 mA	8KX8	3-STATE	4.572 mm	8	0.03 A	65536 bit		PARALLEL	COMMON	MULTI-PORT SRAM	4.5 V	5.5 V	4.5 V		24.2062 mm	24.2062 mm
IDT70V3399S133BFG	Integrated Device Technology Inc	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	208	208	Transferred	INTEGRATED DEVICE TECHNOLOGY INC	BGA	LFBGA, BGA208,17X17,32	4.2 ns	133 MHz	3	131072 words	128000	70 °C	CERAMIC, METAL-SEALED COFIRED	LFBGA	BGA208,17X17,32	SQUARE	GRID ARRAY, LOW PROFILE, FINE PITCH	3.3 V	有	e1	有	3A991.B.2.A	Tin/Silver/Copper (Sn/Ag/Cu)	FLOW-THROUGH OR PIPELINED ARCHITECTURE	8542.32.00.41	BOTTOM	BALL	260	1	0.8 mm	compliant	30	S-CBGA-B208	不合格	COMMERCIAL	2	SYNCHRONOUS	0.4 mA	128KX18	3-STATE	1.7 mm	18	0.03 A	2359296 bit		PARALLEL	COMMON	MULTI-PORT SRAM	3.15 V	3.45 V	3.15 V		15 mm	15 mm
IDT7130SA45L52	Integrated Device Technology Inc	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	52	52	LCC	QCCN, LCC52,.75SQ	45 ns	1024 words	1000	70 °C	CERAMIC, METAL-SEALED COFIRED	QCCN	LCC52,.75SQ	SQUARE	CHIP CARRIER	5 V	无	Obsolete	INTEGRATED DEVICE TECHNOLOGY INC	e0	无	EAR99	锡铅	INTERRUPT FLAG; AUTOMATIC POWER-DOWN	8542.32.00.41	QUAD	无铅		1	1.27 mm	not_compliant		S-CQCC-N52	不合格	COMMERCIAL	2	ASYNCHRONOUS	0.19 mA	1KX8	3-STATE	2.2098 mm	8	0.015 A	8192 bit		PARALLEL	COMMON	MULTI-PORT SRAM	4.5 V	5.5 V	4.5 V	YES	19.05 mm	19.05 mm
IDT7005L20JB	Integrated Device Technology Inc	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	68	68	Transferred	INTEGRATED DEVICE TECHNOLOGY INC	LCC	QCCJ, LDCC68,1.0SQ	20 ns	1	8192 words	8000	125 °C	-55 °C	PLASTIC/EPOXY	QCCJ	LDCC68,1.0SQ	SQUARE	CHIP CARRIER	5 V	无	e0	无	3A001.A.2.C	锡铅		8542.32.00.41	QUAD	J BEND	225	1	1.27 mm	not_compliant	20	S-PQCC-J68	不合格	MILITARY	2	ASYNCHRONOUS	0.32 mA	8KX8	3-STATE	4.572 mm	8	0.004 A	65536 bit		PARALLEL	COMMON	MULTI-PORT SRAM	2 V	5.5 V	4.5 V		24.2062 mm	24.2062 mm
IDT8M824S45CB	Integrated Device Technology Inc	数据表	N/A	-	最小起订量: 1 最小包装量: 1	NO	32	45 ns	131072 words	128000	125 °C	-55 °C	CERAMIC, METAL-SEALED COFIRED	DIP	DIP32,.6	RECTANGULAR	微电子组件	5 V		无	Obsolete	INTEGRATED DEVICE TECHNOLOGY INC	e0		3A001.A.2.C	锡铅	TTL COMPATIBLE INPUTS/OUTPUTS	8542.32.00.41	DUAL	THROUGH-HOLE		1	2.54 mm	not_compliant		R-CDMA-T32	不合格	MILITARY		ASYNCHRONOUS	0.265 mA	128KX8	3-STATE		8	0.08 A	1048576 bit	38535Q/M;38534H;883B	PARALLEL	COMMON	SRAM MODULE	4.5 V	5.5 V	4.5 V
IDT7005S20PFB	Integrated Device Technology Inc	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	64	64	QFP	LQFP, QFP64,.66SQ,32	20 ns	Obsolete	无	5 V	FLATPACK, LOW PROFILE	SQUARE	QFP64,.66SQ,32	LQFP	PLASTIC/EPOXY	-55 °C	125 °C	8000	8192 words	3	INTEGRATED DEVICE TECHNOLOGY INC	e0	无	3A001.A.2.C	锡铅		8542.32.00.41	QUAD	鸥翼	240	1	0.8 mm	not_compliant	30	S-PQFP-G64	不合格	MILITARY	2	ASYNCHRONOUS	0.37 mA	8KX8	3-STATE	1.6 mm	8	0.03 A	65536 bit		PARALLEL	COMMON	MULTI-PORT SRAM	4.5 V	5.5 V	4.5 V		14 mm	14 mm
IDT71256L20TP	Integrated Device Technology Inc	数据表	N/A	-	最小起订量: 1 最小包装量: 1	NO	28	28	DIP	0.300 INCH, PLASTIC, DIP-28	20 ns	32768 words	32000	70 °C	PLASTIC/EPOXY	DIP	DIP28,.3	RECTANGULAR	IN-LINE	5 V	无	Obsolete	INTEGRATED DEVICE TECHNOLOGY INC	e0		EAR99	Tin/Lead (Sn85Pb15)		8542.32.00.41	DUAL	THROUGH-HOLE		1	2.54 mm	not_compliant		R-PDIP-T28	不合格	COMMERCIAL	1	ASYNCHRONOUS	0.135 mA	32KX8	3-STATE	4.57 mm	8	0.00012 A	262144 bit		PARALLEL	COMMON	标准SRAM	2 V	5.5 V	4.5 V	YES	34.67 mm	7.62 mm
IDT7142SA90L52	Integrated Device Technology Inc	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	52	52	LCC52,.75SQ	QCCN	CERAMIC, METAL-SEALED COFIRED	70 °C	2000	2048 words	90 ns	LCC-52	LCC	INTEGRATED DEVICE TECHNOLOGY INC	Obsolete	无	5 V	CHIP CARRIER	SQUARE	e0	无	EAR99	锡铅	AUTOMATIC POWER-DOWN	8542.32.00.41	QUAD	无铅		1	1.27 mm	not_compliant		S-CQCC-N52	不合格	COMMERCIAL	2	ASYNCHRONOUS	0.18 mA	2KX8	3-STATE	2.2098 mm	8	0.015 A	16384 bit	MIL-STD-883 Class B (Modified)	PARALLEL	COMMON	MULTI-PORT SRAM	4.5 V	5.5 V	4.5 V	YES	19.05 mm	19.05 mm
70V3389S6BFG	Integrated Device Technology Inc	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	208	208	Transferred	INTEGRATED DEVICE TECHNOLOGY INC	BGA	TFBGA, BGA208,17X17,32	6 ns	83 MHz	3	65536 words	64000	70 °C	CERAMIC, METAL-SEALED COFIRED	TFBGA	BGA208,17X17,32	SQUARE	GRID ARRAY, THIN PROFILE, FINE PITCH	3.3 V	有	e1	有	3A991.B.2.A	Tin/Silver/Copper (Sn/Ag/Cu)	PIPELINED OUTPUT MODE; SELF-TIMED WRITE CYCLE	8542.32.00.41	BOTTOM	BALL	260	1	0.8 mm	compliant	30	S-CBGA-B208	不合格	COMMERCIAL	2	SYNCHRONOUS	0.31 mA	64KX18	3-STATE	1.2 mm	18	0.015 A	1179648 bit		PARALLEL	COMMON	MULTI-PORT SRAM	3.15 V	3.45 V	3.15 V		15 mm	15 mm
IDT70V24L25PFG	Integrated Device Technology Inc	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	100	100	INTEGRATED DEVICE TECHNOLOGY INC	QFP	LFQFP, QFP100,.63SQ,20	25 ns	3	4096 words	4000	70 °C	PLASTIC/EPOXY	LFQFP	QFP100,.63SQ,20	SQUARE	FLATPACK, LOW PROFILE, FINE PITCH	3.3 V	有	Transferred	e3	有	EAR99	Matte Tin (Sn) - annealed		8542.32.00.41	QUAD	鸥翼	260	1	0.5 mm	compliant	30	S-PQFP-G100	不合格	COMMERCIAL	2	ASYNCHRONOUS	0.165 mA	4KX16	3-STATE	1.6 mm	16	0.0025 A	65536 bit		PARALLEL	COMMON	MULTI-PORT SRAM	3 V	3.6 V	3 V		14 mm	14 mm