N/A

-

YES

52

52

Transferred

INTEGRATED DEVICE TECHNOLOGY INC

LCC

QCCJ, LDCC52,.8SQ

25 ns

1

1024 words

1000

125 °C

-55 °C

PLASTIC/EPOXY

QCCJ

LDCC52,.8SQ

SQUARE

CHIP CARRIER

5 V

无

e0

无

3A001.A.2.C

锡铅

8542.32.00.41

QUAD

J BEND

225

1

1.27 mm

not_compliant

20

S-PQCC-J52

不合格

MILITARY

2

ASYNCHRONOUS

0.22 mA

1KX8

3-STATE

4.57 mm

8

0.004 A

8192 bit

MIL-PRF-38535

PARALLEL

COMMON

MULTI-PORT SRAM

2 V

5.5 V

4.5 V

19.1262 mm

19.1262 mm

N/A

-

YES

100

100

65536 words

64000

70 °C

PLASTIC/EPOXY

LFQFP

QFP100,.63SQ,20

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

3.3 V

无

Transferred

INTEGRATED DEVICE TECHNOLOGY INC

QFP

14 X 14 MM, 1.40 MM HEIGHT, TQFP-100

18 ns

83 MHz

3

e0

无

3A991.B.2.B

Tin/Lead (Sn85Pb15)

FLOW-THROUGH OR PIPELINED ARCHITECTURE

8542.32.00.41

QUAD

鸥翼

240

1

0.5 mm

not_compliant

20

S-PQFP-G100

不合格

COMMERCIAL

2

SYNCHRONOUS

0.335 mA

64KX8

3-STATE

1.6 mm

8

0.005 A

524288 bit

PARALLEL

COMMON

MULTI-PORT SRAM

3 V

3.6 V

3 V

14 mm

14 mm

N/A

-

YES

119

119

Obsolete

INTEGRATED DEVICE TECHNOLOGY INC

BGA

PLASTIC, BGA-119

12 ns

3

131072 words

128000

85 °C

-40 °C

PLASTIC/EPOXY

BGA

BGA119,7X17,50

RECTANGULAR

网格排列

3.3 V

无

e0

3A991.B.2.A

锡铅

8542.32.00.41

BOTTOM

BALL

225

1

1.27 mm

not_compliant

20

R-PBGA-B119

不合格

INDUSTRIAL

ASYNCHRONOUS

0.275 mA

128KX24

3-STATE

2.36 mm

24

0.01 A

3145728 bit

PARALLEL

COMMON

标准SRAM

3 V

3.6 V

3 V

22 mm

14 mm

N/A

-

NO

32

Obsolete

无

微电子组件

RECTANGULAR

DIP32,.6

DIP

CERAMIC, METAL-SEALED COFIRED

-55 °C

125 °C

128000

131072 words

70 ns

5 V

INTEGRATED DEVICE TECHNOLOGY INC

e0

3A001.A.2.C

锡铅

TTL COMPATIBLE INPUTS/OUTPUTS

8542.32.00.41

DUAL

THROUGH-HOLE

1

2.54 mm

not_compliant

R-CDMA-T32

不合格

MILITARY

ASYNCHRONOUS

0.265 mA

128KX8

3-STATE

8

0.08 A

1048576 bit

38535Q/M;38534H;883B

PARALLEL

COMMON

SRAM MODULE

4.5 V

5.5 V

4.5 V

N/A

-

NO

28

28

DIP

0.300 INCH, PLASTIC, DIP-28

20 ns

32768 words

32000

70 °C

PLASTIC/EPOXY

DIP

DIP28,.3

RECTANGULAR

IN-LINE

5 V

无

Obsolete

INTEGRATED DEVICE TECHNOLOGY INC

e0

EAR99

Tin/Lead (Sn85Pb15)

8542.32.00.41

DUAL

THROUGH-HOLE

1

2.54 mm

not_compliant

R-PDIP-T28

不合格

COMMERCIAL

1

ASYNCHRONOUS

0.135 mA

32KX8

3-STATE

4.57 mm

8

0.00012 A

262144 bit

PARALLEL

COMMON

标准SRAM

2 V

5.5 V

4.5 V

YES

34.67 mm

7.62 mm

N/A

-

YES

52

52

LCC52,.75SQ

QCCN

CERAMIC, METAL-SEALED COFIRED

70 °C

2000

2048 words

90 ns

LCC-52

LCC

INTEGRATED DEVICE TECHNOLOGY INC

Obsolete

无

5 V

CHIP CARRIER

SQUARE

e0

无

EAR99

锡铅

AUTOMATIC POWER-DOWN

8542.32.00.41

QUAD

无铅

1

1.27 mm

not_compliant

S-CQCC-N52

不合格

COMMERCIAL

2

ASYNCHRONOUS

0.18 mA

2KX8

3-STATE

2.2098 mm

8

0.015 A

16384 bit

MIL-STD-883 Class B (Modified)

PARALLEL

COMMON

MULTI-PORT SRAM

4.5 V

5.5 V

4.5 V

YES

19.05 mm

19.05 mm

N/A

-

YES

208

208

无

Obsolete

INTEGRATED DEVICE TECHNOLOGY INC

QFP

PLASTIC, QFP-208

6 ns

83 MHz

3

16384 words

16000

85 °C

-40 °C

PLASTIC/EPOXY

FQFP

QFP208,1.2SQ,20

SQUARE

FLATPACK, FINE PITCH

3.3 V

e0

无

3A991.B.2.B

Tin/Lead (Sn/Pb)

PIPELINED OUTPUT MODE; SELF TIMED WRITE CYCLE

8542.32.00.41

QUAD

鸥翼

未说明

1

0.5 mm

not_compliant

未说明

S-PQFP-G208

不合格

INDUSTRIAL

2

SYNCHRONOUS

0.36 mA

16KX36

3-STATE

4.1 mm

36

0.03 A

589824 bit

PARALLEL

COMMON

MULTI-PORT SRAM

3.15 V

3.45 V

3.15 V

28 mm

28 mm

N/A

-

YES

100

100

Obsolete

INTEGRATED DEVICE TECHNOLOGY INC

QFP

14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100

4.2 ns

133 MHz

3

262144 words

256000

70 °C

PLASTIC/EPOXY

LQFP

QFP100,.63X.87

RECTANGULAR

FLATPACK, LOW PROFILE

3.3 V

无

e0

3A991.B.2.A

Tin/Lead (Sn85Pb15)

流水线结构

8542.32.00.41

QUAD

鸥翼

225

1

0.65 mm

not_compliant

20

R-PQFP-G100

不合格

COMMERCIAL

SYNCHRONOUS

0.3 mA

256KX18

3-STATE

1.6 mm

18

0.04 A

4718592 bit

PARALLEL

COMMON

ZBT SRAM

3.14 V

3.465 V

3.135 V

20 mm

14 mm

N/A

-

YES

100

100

无

Obsolete

INTEGRATED DEVICE TECHNOLOGY INC

QFP

14 X 20 MM, PLASTIC, TQFP-100

4.5 ns

117 MHz

3

131072 words

128000

85 °C

-40 °C

PLASTIC/EPOXY

LQFP

QFP100,.63X.87

RECTANGULAR

FLATPACK, LOW PROFILE

3.3 V

e0

无

3A991.B.2.A

Tin/Lead (Sn85Pb15)

8542.32.00.41

QUAD

鸥翼

225

1

0.65 mm

not_compliant

20

R-PQFP-G100

不合格

INDUSTRIAL

SYNCHRONOUS

0.285 mA

128KX36

3-STATE

1.6 mm

36

0.045 A

4718592 bit

PARALLEL

COMMON

ZBT SRAM

3.14 V

3.465 V

3.135 V

20 mm

14 mm

N/A

-

NO

24

24

RECTANGULAR

DIP24,.3

DIP

CERAMIC, METAL-SEALED COFIRED

-55 °C

125 °C

16000

16384 words

45 ns

0.300 INCH, SIDE BRAZED, DIP-24

DIP

INTEGRATED DEVICE TECHNOLOGY INC

Obsolete

无

5 V

IN-LINE

e0

无

3A001.A.2.C

锡铅

8542.32.00.41

DUAL

THROUGH-HOLE

1

2.54 mm

not_compliant

R-CDIP-T24

不合格

MILITARY

1

ASYNCHRONOUS

0.11 mA

16KX4

3-STATE

5.08 mm

4

0.0006 A

65536 bit

38535Q/M;38534H;883B

PARALLEL

COMMON

标准SRAM

2 V

5.5 V

4.5 V

YES

30.607 mm

7.62 mm

N/A

-

YES

84

84

Obsolete

INTEGRATED DEVICE TECHNOLOGY INC

LCC

QCCJ, LDCC84,1.2SQ

25 ns

1

4096 words

4000

85 °C

-40 °C

PLASTIC/EPOXY

QCCJ

LDCC84,1.2SQ

SQUARE

CHIP CARRIER

3.3 V

无

e0

无

EAR99

Tin/Lead (Sn85Pb15)

INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN

8542.32.00.41

QUAD

J BEND

225

1

2.54 mm

not_compliant

30

S-PQCC-J84

不合格

INDUSTRIAL

2

ASYNCHRONOUS

0.19 mA

4KX16

3-STATE

4.572 mm

16

0.005 A

65536 bit

PARALLEL

COMMON

MULTI-PORT SRAM

3 V

3.6 V

3 V

29.3116 mm

29.3116 mm

N/A

-

YES

100

100

INTEGRATED DEVICE TECHNOLOGY INC

QFP

14 X 14 MM, 1.40 MM HEIGHT, TQFP-100

25 ns

3

65536 words

64000

70 °C

PLASTIC/EPOXY

LFQFP

QFP100,.63SQ,20

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

3.3 V

无

Obsolete

e0

EAR99

Tin/Lead (Sn85Pb15)

8542.32.00.41

QUAD

鸥翼

240

1

0.5 mm

not_compliant

20

S-PQFP-G100

不合格

COMMERCIAL

2

ASYNCHRONOUS

0.25 mA

64KX16

3-STATE

1.6 mm

16

0.006 A

1048576 bit

PARALLEL

COMMON

MULTI-PORT SRAM

3.14 V

3.465 V

3.135 V

14 mm

14 mm

N/A

-

YES

100

100

Obsolete

INTEGRATED DEVICE TECHNOLOGY INC

QFP

14 X 20 MM, PLASTIC, TQFP-100

8.5 ns

86 MHz

3

131072 words

128000

70 °C

PLASTIC/EPOXY

LQFP

QFP100,.63X.87

RECTANGULAR

FLATPACK, LOW PROFILE

3.3 V

无

e0

3A991.B.2.A

Tin/Lead (Sn85Pb15)

FLOW-THROUGH ARCHITECTURE

8542.32.00.41

QUAD

鸥翼

225

1

0.65 mm

not_compliant

20

R-PQFP-G100

不合格

COMMERCIAL

SYNCHRONOUS

0.18 mA

128KX36

3-STATE

1.6 mm

36

0.03 A

4718592 bit

PARALLEL

COMMON

缓存SRAM

3.14 V

3.465 V

3.135 V

20 mm

14 mm

N/A

-

YES

64

64

LQFP

QFP64,.66SQ,32

SQUARE

FLATPACK, LOW PROFILE

5 V

有

Transferred

INTEGRATED DEVICE TECHNOLOGY INC

QFP

LQFP, QFP64,.66SQ,32

55 ns

3

2048 words

2000

70 °C

PLASTIC/EPOXY

e3

有

EAR99

Matte Tin (Sn) - annealed

自动断电

8542.32.00.41

QUAD

鸥翼

260

1

0.8 mm

compliant

30

S-PQFP-G64

不合格

COMMERCIAL

2

ASYNCHRONOUS

0.155 mA

2KX8

3-STATE

1.6 mm

8

0.015 A

16384 bit

PARALLEL

COMMON

MULTI-PORT SRAM

4.5 V

5.5 V

4.5 V

14 mm

14 mm

N/A

-

YES

100

100

INTEGRATED DEVICE TECHNOLOGY INC

QFP

LFQFP, QFP100,.63SQ,20

35 ns

3

32768 words

32000

70 °C

PLASTIC/EPOXY

LFQFP

QFP100,.63SQ,20

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

3.3 V

有

Transferred

e3

有

EAR99

Matte Tin (Sn) - annealed

8542.32.00.41

QUAD

鸥翼

260

1

0.5 mm

compliant

30

S-PQFP-G100

不合格

COMMERCIAL

2

ASYNCHRONOUS

0.19 mA

32KX16

3-STATE

1.6 mm

16

0.003 A

524288 bit

PARALLEL

COMMON

MULTI-PORT SRAM

3 V

3.6 V

3 V

14 mm

14 mm

N/A

-

YES

32

32

无

Obsolete

INTEGRATED DEVICE TECHNOLOGY INC

QFJ

LCC-32

25 ns

125 °C

-55 °C

CERAMIC, METAL-SEALED COFIRED

QCCN

LCC32,.45X.55

RECTANGULAR

CHIP CARRIER

5 V

32768 words

32000

e0

3A001.A.2.C

锡铅

8542.32.00.41

QUAD

无铅

1

1.27 mm

not_compliant

R-CQCC-N32

不合格

MILITARY

1

ASYNCHRONOUS

0.15 mA

32KX8

3-STATE

3.048 mm

8

0.02 A

262144 bit

MIL-STD-883 Class B

PARALLEL

COMMON

标准SRAM

4.5 V

5.5 V

4.5 V

YES

13.97 mm

11.43 mm

N/A

-

YES

100

100

7.5 ns

14 X 20 MM, 1.40 MM, PLASTIC, TQFP-100

QFP

INTEGRATED DEVICE TECHNOLOGY INC

Obsolete

无

3.3 V

FLATPACK, LOW PROFILE

RECTANGULAR

QFP100,.63X.87

LQFP

PLASTIC/EPOXY

70 °C

256000

262144 words

3

117 MHz

e0

3A991.B.2.A

Tin/Lead (Sn85Pb15)

FLOW-THROUGH ARCHITECTURE

8542.32.00.41

QUAD

鸥翼

225

1

0.65 mm

not_compliant

20

R-PQFP-G100

不合格

COMMERCIAL

SYNCHRONOUS

0.265 mA

256KX36

3-STATE

1.6 mm

36

0.05 A

9437184 bit

PARALLEL

COMMON

缓存SRAM

3.14 V

3.465 V

3.135 V

20 mm

14 mm

N/A

-

YES

64

64

Transferred

INTEGRATED DEVICE TECHNOLOGY INC

QFP

LQFP, QFP64,.66SQ,32

35 ns

3

8192 words

8000

85 °C

-40 °C

PLASTIC/EPOXY

LQFP

QFP64,.66SQ,32

SQUARE

FLATPACK, LOW PROFILE

5 V

有

e3

有

EAR99

哑光锡

8542.32.00.41

QUAD

鸥翼

260

1

0.8 mm

compliant

40

S-PQFP-G64

不合格

INDUSTRIAL

2

ASYNCHRONOUS

0.25 mA

8KX8

3-STATE

1.6 mm

8

0.004 A

65536 bit

PARALLEL

COMMON

MULTI-PORT SRAM

2 V

5.5 V

4.5 V

14 mm

14 mm

N/A

-

YES

100

100

INTEGRATED DEVICE TECHNOLOGY INC

QFP

LFQFP,

25 ns

3

8192 words

8000

125 °C

-55 °C

PLASTIC/EPOXY

LFQFP

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

5 V

无

Obsolete

e0

无

3A001.A.2.C

Tin/Lead (Sn85Pb15)

CONFIGURABLE AS 8K X 16

8542.32.00.41

QUAD

鸥翼

240

1

0.5 mm

not_compliant

20

S-PQFP-G100

不合格

MILITARY

ASYNCHRONOUS

8KX16

1.6 mm

16

131072 bit

MIL-PRF-38535

PARALLEL

DUAL-PORT SRAM

5.5 V

4.5 V

14 mm

14 mm

N/A

-

YES

32

32

RECTANGULAR

LCC32,.45X.55

QCCN

CERAMIC, METAL-SEALED COFIRED

-55 °C

125 °C

2000

2048 words

120 ns

LCC-32

QFJ

INTEGRATED DEVICE TECHNOLOGY INC

Obsolete

无

5 V

CHIP CARRIER

e0

3A001.A.2.C

Tin/Lead (Sn/Pb)

8542.32.00.41

QUAD

无铅

1

1.27 mm

not_compliant

R-CQCC-N32

不合格

MILITARY

1

ASYNCHRONOUS

0.1 mA

2KX8

3-STATE

3.048 mm

8

0.01 A

16384 bit

38535Q/M;38534H;883B

PARALLEL

COMMON

标准SRAM

4.5 V

5.5 V

4.5 V

YES

13.97 mm

11.43 mm

N/A

-

NO

68

68

INTEGRATED DEVICE TECHNOLOGY INC

DIP

0.600 INCH, 0.070 INCH PITCH, SIDE BRAZED, SDIP-68

70 ns

2048 words

2000

125 °C

-55 °C

CERAMIC, METAL-SEALED COFIRED

SDIP

SDIP68,.6

RECTANGULAR

IN-LINE, SHRINK PITCH

5 V

无

Obsolete

e0

无

3A001.A.2.C

锡铅

AUTOMATIC POWER-DOWN

8542.32.00.41

DUAL

THROUGH-HOLE

1

1.778 mm

not_compliant

R-CDIP-T68

不合格

MILITARY

2

ASYNCHRONOUS

0.24 mA

2KX16

3-STATE

4.826 mm

16

0.004 A

32768 bit

38535Q/M;38534H;883B

PARALLEL

COMMON

MULTI-PORT SRAM

2 V

5.5 V

4.5 V

YES

61.214 mm

15.24 mm

N/A

-

YES

64

64

SQUARE

QFP64,.66SQ,32

LQFP

PLASTIC/EPOXY

70 °C

16000

16384 words

3

45 ns

PLASTIC, TQFP-64

QFP

INTEGRATED DEVICE TECHNOLOGY INC

Obsolete

无

5 V

FLATPACK, LOW PROFILE

e0

EAR99

锡铅

INTERRUPT FLAG; ARBITER; SEMAPHORE

8542.32.00.41

QUAD

鸥翼

240

1

0.8 mm

not_compliant

30

S-PQFP-G64

不合格

COMMERCIAL

2

ASYNCHRONOUS

0.34 mA

16KX8

3-STATE

1.6 mm

8

0.015 A

131072 bit

PARALLEL

COMMON

MULTI-PORT SRAM

4.5 V

5.5 V

4.5 V

YES

14 mm

14 mm

N/A

-

NO

48

48

DIP

0.550 X 2.430 INCH, 0.180 INCH HEIGHT, PLASTIC, DIP-48

25 ns

2048 words

2000

70 °C

PLASTIC/EPOXY

DIP

DIP48,.6

RECTANGULAR

IN-LINE

5 V

无

Obsolete

INTEGRATED DEVICE TECHNOLOGY INC

e0

EAR99

Tin/Lead (Sn85Pb15)

备用电池

8542.32.00.41

DUAL

THROUGH-HOLE

1

2.54 mm

not_compliant

R-PDIP-T48

不合格

COMMERCIAL

2

ASYNCHRONOUS

0.17 mA

2KX8

3-STATE

5.08 mm

8

0.0015 A

16384 bit

PARALLEL

COMMON

MULTI-PORT SRAM

2 V

5.5 V

4.5 V

61.849 mm

15.24 mm

N/A

-

YES

100

100

Obsolete

INTEGRATED DEVICE TECHNOLOGY INC

QFP

14 X 20 MM, PLASTIC, TQFP-100

3.5 ns

166 MHz

3

131072 words

128000

70 °C

PLASTIC/EPOXY

LQFP

QFP100,.63X.87

RECTANGULAR

FLATPACK, LOW PROFILE

3.3 V

无

e0

无

3A991.B.2.A

Tin/Lead (Sn85Pb15)

ALSO REQUIRES 3.3V I/O SUPPLY

8542.32.00.41

QUAD

鸥翼

225

1

0.65 mm

not_compliant

20

R-PQFP-G100

不合格

COMMERCIAL

SYNCHRONOUS

0.32 mA

128KX36

3-STATE

1.6 mm

36

0.02 A

4718592 bit

PARALLEL

COMMON

缓存SRAM

3.14 V

3.465 V

3.135 V

20 mm

14 mm

N/A

-

YES

28

28

SOJ

0.300 INCH, PLASTIC, SOJ-28

7 ns

3

16384 words

16000

75 °C

PLASTIC/EPOXY

SOJ

SOJ28,.34

RECTANGULAR

小概要

无

Obsolete

INTEGRATED DEVICE TECHNOLOGY INC

e0

EAR99

锡铅

8542.32.00.41

DUAL

J BEND

225

1

1.27 mm

not_compliant

30

R-PDSO-J28

不合格

商业扩展

ASYNCHRONOUS

16KX4

OPEN-EMITTER

3.556 mm

4

65536 bit

PARALLEL

SEPARATE

标准SRAM

17.9324 mm

7.5184 mm