Kingston Technology HX426S15IB2/16

ECCN (US)

EAR99

Module

DRAM模块

Module Density

16Gbyte

Number of Chip per Module

16

Chip Density (bit)

8G

Data Bus Width (bit)

64

Maximum Clock Rate (MHz)

2666

Chip Configuration

1Gx8

Chip Package Type

FBGA

Typical Operating Supply Voltage (V)

1.2

Minimum Operating Temperature (°C)

0

Maximum Operating Temperature (°C)

85

Module Sides

Double

ECC Support

无

Number of Ranks

Dual

CAS Latency

15

SPD EEPROM Support

无

Supplier Package

SODIMM

Mounting

Socket

Package Height

30

Package Length

69.6

PCB changed

260

零件状态

Obsolete

引脚数量

260

组织结构

2Gx64

锁相环

无

模块类型

260SODIMM

RoHS状态

供应商未确认