Kingston Technology HX430C15PB3AK2/32

ECCN (US)

EAR99

Module

DRAM模块

Module Density

32Gbyte

Number of Chip per Module

16

Chip Density (bit)

8G

Data Bus Width (bit)

64

Maximum Clock Rate (MHz)

3000

Chip Configuration

1Gx8

Chip Package Type

FBGA

Typical Operating Supply Voltage (V)

1.2

Minimum Operating Temperature (°C)

0

Maximum Operating Temperature (°C)

70

Module Sides

Double

ECC Support

无

Number of Ranks

Dual

CAS Latency

15

Supplier Package

DIMM

Mounting

Socket

Package Height

42.2

Package Length

133.35

Package Width

8

PCB changed

288

零件状态

活跃

引脚数量

288

组织结构

4Gx64

自我刷新

有

模块类型

288DIMM

RoHS状态

供应商未确认