Kingston Technology KSM24ES8/8ME

ECCN (US)

EAR99

HTS

8473.30.11.40

Module

DRAM模块

Module Density

8Gbyte

Number of Chip per Module

9

Chip Density (bit)

8G

Data Bus Width (bit)

72

Maximum Clock Rate (MHz)

2400

Chip Configuration

1Gx8

Chip Package Type

FBGA

Typical Operating Supply Voltage (V)

1.2

Operating Current (mA)

1305

Minimum Operating Temperature (°C)

0

Maximum Operating Temperature (°C)

85

ECC Support

有

Number of Ranks

Single

CAS Latency

17

Supplier Package

DIMM

Mounting

Socket

Package Height

31.25

Package Length

133.35

PCB changed

288

零件状态

Obsolete

引脚数量

288

组织结构

1Gx72

记忆密度

8

模块类型

288DIMM

RoHS状态

符合RoHS标准