Kingston Technology KSM26ES8/8HD

ECCN (US)

4A994.a

Module

DRAM模块

Module Density

8Gbyte

Number of Chip per Module

9

Chip Density (bit)

8G

Data Bus Width (bit)

72

Maximum Clock Rate (MHz)

2666

Chip Configuration

1Gx8

Chip Package Type

FBGA

Typical Operating Supply Voltage (V)

1.2

Operating Current (mA)

894

Minimum Operating Temperature (°C)

0

Maximum Operating Temperature (°C)

85

Module Sides

Single

ECC Support

有

Number of Ranks

Single

CAS Latency

19

PC Type

PC4-2666

SPD EEPROM Support

有

Supplier Package

DIMM

Mounting

Socket

Package Height

31.25

Package Length

133.35

PCB changed

288

零件状态

活跃

引脚数量

288

组织结构

1Gx72

锁相环

无

自我刷新

有

模块类型

288DIMM

RoHS状态

符合RoHS标准