Kingston Technology KSM26RD4/32MEI

ECCN (US)

EAR99

HTS

8473.30.11.40

Module

DRAM模块

Module Density

32Gbyte

Number of Chip per Module

36

Chip Density (bit)

8G

Data Bus Width (bit)

72

Maximum Clock Rate (MHz)

2666

Chip Configuration

2Gx4

Chip Package Type

FBGA

Typical Operating Supply Voltage (V)

1.2

Operating Current (mA)

2808

Minimum Operating Temperature (°C)

0

Maximum Operating Temperature (°C)

85

ECC Support

有

Number of Ranks

Dual

CAS Latency

19

Supplier Package

RDIMM

Mounting

Socket

Package Height

31.25

Package Length

133.35

PCB changed

288

零件状态

Obsolete

引脚数量

288

组织结构

4Gx72

模块类型

288DIMM

RoHS状态

符合RoHS标准