Kingston Technology KSM26RD4/64MER

ECCN (US)

4A994.a

HTS

8473.30.11.40

Module

DRAM模块

Module Density

64Gbyte

Number of Chip per Module

36

Chip Density (bit)

16G

Data Bus Width (bit)

72

Maximum Clock Rate (MHz)

2666

Chip Configuration

4Gx4

Chip Package Type

FBGA

Typical Operating Supply Voltage (V)

1.2

Operating Current (mA)

2700

Minimum Operating Temperature (°C)

0

Maximum Operating Temperature (°C)

85

Module Sides

Double

ECC Support

有

Number of Ranks

Dual

CAS Latency

19

SPD EEPROM Support

无

Supplier Package

RDIMM

Mounting

Socket

Package Height

31.25

Package Length

133.35

PCB changed

288

零件状态

活跃

引脚数量

288

组织结构

8Gx72

锁相环

无

自我刷新

有

模块类型

288RDIMM

RoHS状态

符合RoHS标准