Kingston Technology KSM26RD8/16HDI

PCB changed

288

Package Length

133.35

Package Height

31.25

Mounting

Socket

Supplier Package

RDIMM

SPD EEPROM Support

无

CAS Latency

19

Number of Ranks

Dual

ECC Support

有

Module Sides

Double

Maximum Operating Temperature (°C)

85

Minimum Operating Temperature (°C)

0

Operating Current (mA)

1589

Typical Operating Supply Voltage (V)

1.2

Chip Package Type

FBGA

Chip Configuration

1Gx8

Maximum Clock Rate (MHz)

2666

Data Bus Width (bit)

72

Chip Density (bit)

8G

Number of Chip per Module

18

Module Density

16Gbyte

Module

DRAM模块

HTS

8473.30.11.40

ECCN (US)

4A994.a

零件状态

活跃

引脚数量

288

组织结构

2Gx72

锁相环

无

自我刷新

有

模块类型

288RDIMM

RoHS状态

符合RoHS标准