Kingston Technology KSM26SED8/16ME

ECCN (US)

EAR99

HTS

8473.30.11.40

Module

DRAM模块

Module Density

16Gbyte

Number of Chip per Module

18

Chip Density (bit)

8G

Data Bus Width (bit)

72

Maximum Clock Rate (MHz)

2666

Chip Configuration

1Gx8

Chip Package Type

FBGA

Typical Operating Supply Voltage (V)

1.2

Operating Current (mA)

1629

Minimum Operating Temperature (°C)

0

Maximum Operating Temperature (°C)

85

ECC Support

有

Number of Ranks

Dual

CAS Latency

17

Supplier Package

SODIMM

Mounting

Socket

Package Height

30

Package Length

69.6

Package Width

3.7(Max)

PCB changed

260

零件状态

Obsolete

引脚数量

260

组织结构

2Gx72

模块类型

260SODIMM

RoHS状态

符合RoHS标准