Kingston Technology KSM32RD8/16HDR

ECCN (US)

4A994.a

HTS

8473.30.11.40

Module

DRAM模块

Module Density

16Gbyte

Number of Chip per Module

18

Chip Density (bit)

8G

Data Bus Width (bit)

72

Maximum Clock Rate (MHz)

3200

Chip Configuration

1Gx8

Chip Package Type

FBGA

Typical Operating Supply Voltage (V)

1.2

Operating Current (mA)

1787

Minimum Operating Temperature (°C)

0

Maximum Operating Temperature (°C)

85

Module Sides

Double

ECC Support

有

Number of Ranks

Dual

CAS Latency

22

SPD EEPROM Support

无

零件状态

活跃

组织结构

2Gx72

锁相环

无

自我刷新

有

模块类型

288RDIMM

RoHS状态

符合RoHS标准