Kingston Technology KVR1333D3E9S/8G

底架

Socket

引脚数

240

Lead Shape

No Lead

PCB changed

240

Package Length

133.35

Package Height

30

Mounting

Socket

Supplier Package

DIMM

Standard Package Name

DIM

SPD EEPROM Support

无

PC Type

PC3-10600

CAS Latency

9

Number of Chip Banks

8

Number of Ranks

Dual

ECC Support

有

Module Sides

Double

Maximum Operating Temperature (°C)

85

Minimum Operating Temperature (°C)

0

Maximum Operating Supply Voltage (V)

1.575

Typical Operating Supply Voltage (V)

1.5

Minimum Operating Supply Voltage (V)

1.425

Chip Package Type

FBGA

Chip Configuration

512Mx8

Maximum Clock Rate (MHz)

1333

Data Bus Width (bit)

72

Chip Density (bit)

4G

Number of Chip per Module

18

Module Density

8Gbyte

Module

DRAM模块

ECCN (US)

EAR99

Number of Elements

18

RoHS

Compliant

零件状态

Obsolete

最高工作温度

85 °C

最小工作温度

0 °C

引脚数量

240

工作电源电压

1.5 V

最大电源电压

1.575 V

最小电源电压

1.425 V

组织结构

1Gx72

最高频率

1.333 GHz

锁相环

无

自我刷新

无

模块类型

240DIMM

RoHS状态

是,有豁免

辐射硬化

无