Kingston Technology KVR1333D3S8S9/2G

ECCN (US)

EAR99

HTS

8473.30.11.40

Module

DRAM模块

Module Density

2Gbyte

Number of Chip per Module

8

Chip Density (bit)

2G

Data Bus Width (bit)

64

Maximum Clock Rate (MHz)

1333

Chip Configuration

256Mx8

Chip Package Type

FBGA

Minimum Operating Supply Voltage (V)

1.425

Typical Operating Supply Voltage (V)

1.5

Maximum Operating Supply Voltage (V)

1.575

Minimum Operating Temperature (°C)

0

Maximum Operating Temperature (°C)

85

Module Sides

Double

ECC Support

无

Number of Ranks

Single

Number of Chip Banks

8

CAS Latency

9

PC Type

PC3-10600

SPD EEPROM Support

无

Standard Package Name

DIMM

Supplier Package

SODIMM

Mounting

Socket

Package Height

30

Package Length

67.6

PCB changed

204

Lead Shape

No Lead

零件状态

Obsolete

引脚数量

204

组织结构

256Mx64

锁相环

无

自我刷新

无

模块类型

204SODIMM

RoHS状态

供应商未确认