Kingston Technology KVR133X64C2/256

ECCN (US)

EAR99

Module

DRAM模块

Module Density

256Mbyte

Number of Chip per Module

8

Chip Density (bit)

256M

Data Bus Width (bit)

64

Maximum Clock Rate (MHz)

133

Chip Configuration

32Mx8

Chip Package Type

TSOP

Minimum Operating Supply Voltage (V)

3

Typical Operating Supply Voltage (V)

3.3

Maximum Operating Supply Voltage (V)

3.6

Module Sides

Single

ECC Support

无

Number of Chip Banks

4

CAS Latency

2

PC Type

PC-133

SPD EEPROM Support

无

Standard Package Name

DIM

Supplier Package

DIMM

Mounting

Socket

Package Height

29.21

Package Length

133.35

PCB changed

168

Lead Shape

No Lead

零件状态

Obsolete

引脚数量

168

组织结构

32Mx64

锁相环

无

自我刷新

无

模块类型

168DIMM

RoHS状态

供应商未确认