Kingston Technology KVR13LE9S8/4

ECCN (US)

EAR99

Module

DRAM模块

Module Density

4Gbyte

Number of Chip per Module

9

Chip Density (bit)

4G

Data Bus Width (bit)

72

Maximum Clock Rate (MHz)

667

Chip Configuration

512Mx8

Chip Package Type

FBGA

Minimum Operating Supply Voltage (V)

1.28/1.425

Typical Operating Supply Voltage (V)

1.35/1.5

Maximum Operating Supply Voltage (V)

1.45/1.575

Minimum Operating Temperature (°C)

0

Maximum Operating Temperature (°C)

85

Module Sides

Single

ECC Support

有

Number of Ranks

Single

CAS Latency

9

PC Type

PC3L-10600

SPD EEPROM Support

有

Standard Package Name

DIM

Supplier Package

DIMM

Mounting

Socket

Package Height

30

Package Length

133.35

PCB changed

240

Lead Shape

No Lead

零件状态

Obsolete

引脚数量

240

组织结构

512Mx72

锁相环

无

自我刷新

有

模块类型

240DIMM

RoHS状态

是,有豁免