Kingston Technology KVR13LR9S8L/2HC

ECCN (US)

EAR99

Module

DRAM模块

Module Density

2Gbyte

Number of Chip per Module

9

Chip Density (bit)

2G

Data Bus Width (bit)

72

Maximum Clock Rate (MHz)

1333

Chip Configuration

256Mx8

Chip Package Type

FBGA

Minimum Operating Supply Voltage (V)

1.28/1.425

Typical Operating Supply Voltage (V)

1.35/1.5

Maximum Operating Supply Voltage (V)

1.45/1.575

Minimum Operating Temperature (°C)

0

Maximum Operating Temperature (°C)

85

Module Sides

Double

ECC Support

有

Number of Ranks

Single

Number of Chip Banks

8

CAS Latency

9

PC Type

PC3-10600

SPD EEPROM Support

无

Standard Package Name

DIM

Supplier Package

VLP RDIMM

Mounting

Socket

Package Height

18.75

Package Length

133.35

PCB changed

240

Lead Shape

No Lead

零件状态

Obsolete

引脚数量

240

组织结构

256Mx72

锁相环

有

自我刷新

无

模块类型

240RDIMM

RoHS状态

供应商未确认