Kingston Technology KVR13LS9S6/2

ECCN (US)

EAR99

HTS

8473.30.11.40

Module

DRAM模块

Module Density

2Gbyte

Number of Chip per Module

4

Chip Density (bit)

4G

Data Bus Width (bit)

64

Maximum Clock Rate (MHz)

667

Chip Configuration

256Mx16

Chip Package Type

FBGA

Minimum Operating Supply Voltage (V)

1.28/1.425

Typical Operating Supply Voltage (V)

1.35/1.5

Maximum Operating Supply Voltage (V)

1.45/1.575

Minimum Operating Temperature (°C)

0

Maximum Operating Temperature (°C)

85

Module Sides

Single

ECC Support

无

Number of Ranks

Single

CAS Latency

9

PC Type

PC3L-10600

SPD EEPROM Support

有

Standard Package Name

DIMM

Supplier Package

SODIMM

Mounting

Socket

Package Height

30

Package Length

67.6

PCB changed

204

Lead Shape

No Lead

RoHS

Non-Compliant

零件状态

LTB

引脚数量

204

组织结构

256Mx64

锁相环

无

自我刷新

有

模块类型

204SODIMM

RoHS状态

是,有豁免

无铅

无铅