Kingston Technology KVR13S9S8/4

工厂交货时间

4 Weeks, 2 Days

表面安装

NO

终端数量

204

ECCN (US)

EAR99

HTS

8542.32.00.24

Module

DRAM模块

Module Density

4Gbyte

Number of Chip per Module

8

Chip Density (bit)

4G

Data Bus Width (bit)

64

Maximum Clock Rate (MHz)

1333

Chip Configuration

512Mx8

Chip Package Type

FBGA

Minimum Operating Supply Voltage (V)

1.425

Typical Operating Supply Voltage (V)

1.5

Maximum Operating Supply Voltage (V)

1.575

Minimum Operating Temperature (°C)

0

Maximum Operating Temperature (°C)

85

Module Sides

Double

ECC Support

无

Number of Ranks

Single

Number of Chip Banks

8

CAS Latency

9

PC Type

PC3-10600

SPD EEPROM Support

无

Standard Package Name

DIMM

Supplier Package

SODIMM

Mounting

Socket

Package Height

30

Package Length

67.6

PCB changed

204

Lead Shape

No Lead

Package Description

DIMM,

Package Style

微电子组件

Number of Words Code

512000000

Package Body Material

UNSPECIFIED

Operating Temperature-Max

85 °C

Manufacturer Part Number

KVR13S9S8/4

Number of Words

536870912 words

Supply Voltage-Nom (Vsup)

1.5 V

Package Code

DIMM

Package Shape

RECTANGULAR

Manufacturer

Kingston Technology Company

Part Life Cycle Code

接触制造商

Ihs Manufacturer

KINGSTON TECHNOLOGY COMPANY INC

Risk Rank

5.16

零件状态

LTB

附加功能

PROGRAMMABLE CAS LATENCY; SEATED HGT-NOM

技术

CMOS

端子位置

DUAL

终端形式

无铅

功能数量

1

Reach合规守则

unknown

引脚数量

204

JESD-30代码

R-XDMA-N204

电源电压-最大值(Vsup)

1.575 V

温度等级

OTHER

电源电压-最小值(Vsup)

1.425 V

端口的数量

1

操作模式

SYNCHRONOUS

组织结构

512Mx64

座位高度-最大

30 mm

内存宽度

64

记忆密度

4

锁相环

无

内存IC类型

DDR内存模块

访问模式

多库页面突发

自我刷新

无

模块类型

204SODIMM

长度

67.6 mm

RoHS状态

是,有豁免