Kingston Technology KVR16LR11D4/16I

ECCN (US)

EAR99

Module

DRAM模块

Module Density

16Gbyte

Number of Chip per Module

36

Chip Density (bit)

4G

Data Bus Width (bit)

72

Maximum Clock Rate (MHz)

800

Chip Configuration

1Gx4

Chip Package Type

FBGA

Minimum Operating Supply Voltage (V)

1.28/1.425

Typical Operating Supply Voltage (V)

1.35/1.5

Maximum Operating Supply Voltage (V)

1.45/1.575

Minimum Operating Temperature (°C)

0

Maximum Operating Temperature (°C)

85

Module Sides

Double

ECC Support

有

Number of Ranks

Dual

CAS Latency

11

PC Type

PC3L-12800

SPD EEPROM Support

有

Standard Package Name

DIM

Supplier Package

RDIMM

Mounting

Socket

Package Height

30

Package Length

133.35

PCB changed

240

Lead Shape

No Lead

零件状态

Obsolete

引脚数量

240

组织结构

2Gx72

锁相环

无

自我刷新

有

模块类型

240DIMM

RoHS状态

是,有豁免