Kingston Technology KVR16LS11/8BK

ECCN (US)

EAR99

HTS

8473.30.11.40

Module

DRAM模块

Module Density

8Gbyte

Number of Chip per Module

16

Chip Density (bit)

4G

Data Bus Width (bit)

64

Maximum Clock Rate (MHz)

1600

Chip Configuration

512Mx8

Chip Package Type

FBGA

Minimum Operating Supply Voltage (V)

1.28/1.425

Typical Operating Supply Voltage (V)

1.35/1.5

Maximum Operating Supply Voltage (V)

1.45/1.575

Minimum Operating Temperature (°C)

0

Maximum Operating Temperature (°C)

85

Module Sides

Double

ECC Support

无

Number of Ranks

Dual

CAS Latency

11

PC Type

PC3L-12800

SPD EEPROM Support

无

零件状态

活跃

组织结构

1Gx64

锁相环

无

自我刷新

有

模块类型

204SODIMM

RoHS状态

是,有豁免