Kingston Technology KVR16N11S6/2BK

ECCN (US)

EAR99

HTS

8473.30.11.40

Module

DRAM模块

Module Density

2Gbyte

Number of Chip per Module

4

Chip Density (bit)

4G

Data Bus Width (bit)

64

Maximum Clock Rate (MHz)

1600

Chip Configuration

256Mx16

Chip Package Type

FBGA

Minimum Operating Supply Voltage (V)

1.425

Typical Operating Supply Voltage (V)

1.5

Maximum Operating Supply Voltage (V)

1.575

Minimum Operating Temperature (°C)

0

Maximum Operating Temperature (°C)

85

Module Sides

Single

ECC Support

无

Number of Ranks

Single

CAS Latency

11

PC Type

PC3-12800

SPD EEPROM Support

有

零件状态

活跃

组织结构

256Mx64

锁相环

无

自我刷新

有

模块类型

240DIMM

RoHS状态

供应商未确认